An implantable device includes an exterior gold surface and a thin film disposed on the exterior gold surface and forming a barrier between the exterior gold surface and an implanted environment, in which the thin film includes molecules with a head portion, the head portion attached to the exterior gold surface.

A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

An implantable device includes an exterior gold surface and a thin film disposed on the exterior gold surface and forming a barrier between the exterior gold surface and an implanted environment, in which the thin film includes molecules with a head portion, the head portion attached to the exterior gold surface.

A fiber-metal laminate of mutually bonded fiber-reinforced composite layers and metal sheets comprises a combination of a fiber-reinforced composite layer and an adjacent metal sheet, in which combination the properties satisfy the following relations: E.sub.lam*E.sub.comp/(E.sub.metal*t.sub.metal.sup.2) has a value between a lower bound given by
a*(Vfc).sup.(b/(Vf-c)) with b=0.36 and c=0.3(1a)
and zero when Vf0.3,(1b)
and an upper bound given by
a*(Vfc).sup.(b/(Vf-c)) with b=0.88 and c=0(1c)
0.10Vf<0.54(2)
0<E.sub.lam*E.sub.comp/(E.sub.metal*t.sub.metal.sup.2)<400*Vf kN/mm.sup.4(3)
wherein a=1200 kN/mm.sup.4; and
E.sub.comp=tensile Young's modulus of the fiber-reinforced composite layer in kN/mm.sup.2 in the combination, taken in the direction of highest stiffness of the composite layer
E.sub.lam=tensile Young's modulus of the total fiber-metal laminate in kN/mm.sup.2, taken in the same direction as for E.sub.comp
E.sub.metal=tensile Young's modulus of the metal sheet in kN/mm.sup.2 in the combination
t.sub.metal=thickness of the metal sheet in mm in the combination
V.sub.f=fiber volume fraction of the fiber-reinforced composite layer in the combination.

A one-part, storage-stable, air-dryable, latex-coatable waterborne film-forming coating composition has dispersed therein sufficient conductive material to provide an autoweldable hardened shop primer layer when applied to metal components. The thus-primed components may be welded together using automated arc welding equipment without having to remove the coating composition at the weld site. The conductive material desirably causes little or no airborne emission of unsafe quantities of heavy metals or other harmful substances when the primer is volatilized or combusted during welding.

A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): ##STR00001##
wherein R.sub.a each independently represent an organic group having an epoxy group; R.sub.b each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO.sub.3.Math.yMg(OH).sub.2.Math.zH.sub.2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

A coated article comprising a metal surface, a first layer of an uncured autodeposition coating and a second uncured paint layer deposited sequentially on the surface without intermediate curing of the autodeposition coating, a process of co-curing said autodeposition coating and paint layer or layers, and a cured coated article having chemical bonds between the cured autodeposition coating layer and at least the cured paint layer immediately adjacent to the cured autodeposition coating layer.

Substrates, optionally coated with an undercoating layer, having grafted there from one or more non-fouling materials are described herein. The non-fouling, polymeric material can be grafted from a variety of substrate materials, particularly polymeric substrates and/or polymeric undercoating layers. The graft-from techniques described herein can result in higher surface densities of the non-fouling material relative to graft-to formulations. Graft-from methods can be used to produce covalently tethered polymers. The compositions described herein are highly resistant protein absorption, particularly in complex media and retain a high degree of non-fouling activity over long periods of time. The compositions described herein may also demonstrate antimicrobial and/or anti-thrombogenic activity. The non-fouling material can be grafted from the substrate, or optionally from an undercoating layer on the substrate, preferably without significantly affecting the mechanical and/or physical properties of the substrate material.