Y10T29/4908

Top port multi-part surface mount MEMS microphone
10321226 · 2019-06-11 · ·

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Quartz crystal unit, quartz crystal oscillator and electronic apparatus
10284143 · 2019-05-07 · ·

In a quartz crystal unit, the unit comprising a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, each of the first and second quartz crystal tuning fork tines having a first vibrational portion including a first width and a second vibrational portion including a second width greater than the first width, at least one groove being formed in at least one of opposite main surfaces of the first vibrational portion of each quartz crystal tuning fork tine, the first width of the first vibrational portion of each quartz crystal tuning fork tine being greater than 0.03 mm and less than 0.075 mm and the second width of the second vibrational portion of each quartz crystal tuning fork tine being greater than 0.04 mm and less than 0.23 mm.

Methods of making stretchable and flexible electronics
10263320 · 2019-04-16 ·

A method of making a stretchable and flexible electronic device includes the steps of creating a computer aided design using a computer modeling software system of the electronic device; digitizing the computer aided design and importing the design into a computer memory of a sewing machine capable of performing embroidery; using the sewing machine and a conductive thread to embroider the design on to a fabric substrate to create the electronic device, whereby the electronic device comprises at least a portion of conductive threads; removing the fabric substrate from the electronic device using heat; coating the electronic device with a polymer.

System and methods for improved acousto-haptic speakers
12058508 · 2024-08-06 · ·

The systems and methods described herein relate to, among other things, a transducer capable of producing acoustic and tactile stimulation. The transducer includes a rigid mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The systems and methods advantageously benefits from both the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity, adjustable and palpable haptic vibrations.

Systems and methods for improved acousto-haptic speakers
10154348 · 2018-12-11 · ·

The systems and methods described herein relate to, among other things, a transducer capable of producing acoustic and tactile stimulation. The transducer includes a rigid mass element disposed on the diaphragm of a speaker. The mass element may optionally be removable and may have a mass selected such that the resonant frequency of the transducer falls within the range of frequencies present in an input electrical audio signal. The systems and methods advantageously benefits from both the fidelity and audio performance of a full-range speaker while simultaneously producing high-fidelity, adjustable and palpable haptic vibrations.

Adjustment method of a magnetic resonance imaging apparatus
10073155 · 2018-09-11 · ·

An adjustment method of a magnetic resonance imaging apparatus includes: a cooling and excitation step in which work of transporting a superconducting magnet to a facility different from a facility where the superconducting magnet is to be installed, cooling a superconducting coil of the superconducting magnet with a refrigerant, and supplying a current from an external power supply for excitation is repeated until a predetermined rated current flows; a demagnetization and transportation step of demagnetizing the superconducting coil and transporting the superconducting magnet to the facility where the superconducting magnet is to be installed in a state where the superconducting coil is cooled by the refrigerant; and an installation step of installing the superconducting magnet in the facility where the superconducting magnet is to be installed and supplying a predetermined rated current from an external power supply to the superconducting coil in order to excite the superconducting coil.

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE
20180249242 · 2018-08-30 · ·

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors
10048146 · 2018-08-14 · ·

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

Method of manufacturing laminated iron core
10040111 · 2018-08-07 · ·

A method of manufacturing a laminated iron core includes performing at least two kinds of selectively-actuated punching processes by actuating respective punching units to form a plurality of iron core pieces, each of the punching units being switchable between an active state or a non-active state, and caulking and laminating the plurality of iron core pieces to manufacture the laminated iron core. The selectively-actuated punching processes are performed in one operation by selectively actuating each of the punching units between the active state and the non-active state.

Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Communication
20240348091 · 2024-10-17 ·

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.