The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Methods are described to create a reduced stiffness microstructure (RSM). A RSM is made by forming a first buckled membrane along a first buckling direction and forming a second buckled membrane along a second buckling direction. The second buckling direction is opposite to the first buckling direction and the first buckled membrane is in contact with the second buckled membrane over a contact area. Within an operating zone, a stiffness of the reduced stiffness microstructure during contact is less than an absolute value of a stiffness of at least one of the first buckled membrane, before contact, and the second buckled membrane, before contact, when the contact area translates along either one of the first buckling direction and the second buckling direction. In the operating zone the stiffness can approach or equal zero.

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

A method for manufacturing a flexible circuit electrode array adapted to electrically communicate with organic tissue including the following steps: a) providing a flexible polymer base layer; b) curing the base layer; c) depositing a metal layer on base layer; d) patterning the metal layer and forming metal traces on the base layer; e) roughening the surface of the base layer; f) chemically reverting the cure of the surface of the base layer; g) depositing a flexible polymer top layer on the surface of the base layer and the metal traces; h) curing the top layer and the surface of the base layer forming one single flexible polymer layer; and i) creating openings through the single layer to the metal trace layer.

A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. A patterned photoresist layer is formed on the carrier substrate. An adhesive layer is formed on the top surface of the patterned photoresist layer. A dielectric substrate is provided. A circuit pattern and a dielectric layer covering the circuit pattern are formed on the dielectric substrate, wherein the dielectric layer has an opening exposing a portion of the circuit pattern. The adhesive layer is adhered to the dielectric layer in a direction that the adhesive layer faces of the dielectric layer. The carrier substrate is removed. A patterned metal layer is formed on a region exposed by the patterned photoresist layer. The patterned photoresist layer is removed. The adhesive layer is removed.

A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37 C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm2 or greater. Methods or manufacturing and using the device are also disclosed.

Locks, systems and methods of monitoring a lock, the lock having a hub with a slot rotatable by a handle to open and close a latchbolt. A locking member is moveable into and out of engagement with the hub slot to prevent and permit movement of the hub and latchbolt. A sensor on the lock, adjacent the hub and locking member, monitors a moving lock component. The sensor may sense the position of the locking member in or out of engagement with the hub slot. The sensor may be a reed switch actuated by a magnet on the moving lock component. The lock may further include a magnet mounted on the hub and the sensor may comprise a reed switch capable of being actuated by the magnet on the hub. The lock and system may include an external control unit having an alarm for controlling operation of the lock.

A device for use in a subterranean well can include a component which degrades in the well, the component being at least one of the group comprising: a) an electrical element which conducts electricity in the well, b) a magnetic element which produces a magnetic field in the well, and c) a substrate which structurally supports an electrical circuit. A method of constructing a device for use in a subterranean well can include determining an environmental condition to be experienced by a component of the device in the well, the component being at least one of the group comprising: a) an electrical element which conducts electricity in the well, b) a magnetic element which produces a magnetic field in the well, and c) a substrate which supports an electrical circuit; selecting the component which degrades when exposed to the environmental condition; and incorporating the component into the device.

A method of manufacturing a digitizer includes forming a circuit layer that detects an input, forming a magnetic field shielding layer that contains disoriented magnetic powder, disposing an adhesive between the circuit layer and the magnetic field shielding layer, and hot pressing the circuit layer and the magnetic field shielding layer so as to orient the magnetic powder.

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.