Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.

An electrical contact assembly includes an electrically nonconductive base, a first electrical contact supported by the base and a second electrical contact supported by the base such that the first contact and the second contact are separated by a space. The first electrical contact is configured to engage a first external conductive circuit element and the a second electrical contact is configured to engage a second external conductive circuit element. The first contact and the second contact are configured such that a portion of the first contact and a portion of the second contact converge as the base moves in a first direction relative to the first and second external conductive circuit elements and diverge as the base moves in a second direction relative to the first and second external conductive circuit elements.

A method of manufacturing bistable strips having different curvatures, each strip including a plurality of portion of layers of materials, wherein at least one specific layer portion is deposited by a plasma spraying method in conditions different for each of the strips.

A superconducting integrated circuit, comprising a plurality of superconducting circuit elements, each having a variation in operating voltage over time; a common power line; and a plurality of bias circuits, each connected to the common power line, and to a respective superconducting circuit element, wherein each respective bias circuit is superconducting during at least one time portion of the operation of a respective superconducting circuit element, and is configured to supply the variation in operating voltage over time to the respective superconducting circuit element.

An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.

Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded together. Each of the substrates in the stack has at least one surface removably bonded to a surface of another substrate in the stack, wherein when the substrates in the stack are debonded, each substrate has at least one surface that has a surface roughness (Ra) of less than or equal to about 0.6 nm.

One aspect of the invention provides a method of forming an energy-dissipative tube. In one embodiment, the method includes: extruding a resin layer over an outer surface of corrugated stainless steel tubing and impregnating the resin layer with metal particles. In another embodiment, the method includes: extruding a resin layer comprising a fire retardant over an outer surface of corrugated stainless steel tubing and impregnating the resin layer with metal particles. In another embodiment, the method includes: extruding a resin layer comprising between about 20% to 60% magnesium hydroxide, aluminum trihydrate, or halogenated fire retardants by weight over an outer surface of corrugated stainless steel tubing and impregnating the resin layer with metal particles selected from the group consisting of: copper, aluminum, gold, silver, and nickel.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.