The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

A measurement system and methods are disclosed. The system has intensity coding optics comprising a plurality of imaging channels with overlapping fields of view. The intensity coding optics are adapted to provide intensity coded information indicative of a position of one or more objects, wherein each of the imaging channels provides a difference in intensity verses an angular position of the one or more objects. The system also has an electromagnetic energy detector adapted to: (a) receive the intensity coded information, wherein the electromagnetic energy detector comprises a size larger than a spatial resolution of the intensity coding optics, and (b) output data from the electromagnetic energy detector; and a processing device adapted to receive the data and determine the position of the one or more objects.

An embodiment of the invention is an air cathode having a porous membrane with at least one hydrophobic surface that contacts a conductive catalytic film that comprises single walled carbon nanotubes (SWNTs) where the nanotubes are in intimate electrical contact. The conductive film can include fullerenes, metals, metal alloys, metal oxides, or electroactive polymers in addition to the SWNTs. In other embodiments of the invention the air cathode is a component of a metal-air battery or a fuel cell.

An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.

Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Corrosion Resistant Ozone Generators, including ozone generating chips, for various purposes including spas, pools and jetted tubs as well as methods for making and using such Corrosion Resistant Ozone Generators.

In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board.

A method for making an electronic product. The method includes processing a flexible substrate (e.g., a web) with the use of a tensioner having a vacuum plate and an indexer that intermittently moves the flexible substrate for processing. While a designated location of the flexible substrate is stopped at a processing location, a process is performed on the designated location. Wherein while the designated location is stopped at the processing location, the vacuum plate of the tensioner moves in an opposite direction of the transport direction.

A manufacturing method of a circuit board and a piezochromic stamp are provided. A circuit pattern is formed on a dielectric substrate. A dielectric layer having a hole or a conductive via and covering the circuit pattern is formed on the dielectric substrate. A conductive seed layer is formed on the dielectric layer. A photoresist layer is formed on the conductive seed layer. A piezochromic stamp is imprinted on the photoresist layer, wherein when the pressing side of the piezochromic stamp is in contact with the conductive seed layer, the light transmittance effect thereof is changed to blocking or allowing light having a specific wavelength to pass through. A patterned photoresist layer is formed by using the piezochromic stamp as a mask. A patterned metal layer is formed on the exposed conductive seed layer. The patterned photoresist layer and the conductive seed layer are removed.