In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board.

An electrochemical sensor system is adapted to assist in determining an analyte concentration of a fluid. The electrochemical sensor system comprises a substrate, conductive material and a hydrogel or liquid. The substrate having porosity therethrough. The conductive material includes at least one electrode. The at least one electrode is coupled to the substrate. The at least one electrode has a first surface and an opposing second surface. The hydrogel or liquid is adapted to assist in carrying the analyte of the fluid to the first and second surfaces of the at least one electrode.

A light emitting diode (LED) lamp includes a lamp housing formed of a pair of housing members connected to each other in a horizontal direction. A printed circuit board (PCB) is detachably connected to an inside of the lamp housing, and includes at least one LED mounted to one surface of the PCB. A power supply unit (PSU) is electrically connected with the PCB in the lamp housing to supply power to the PCB.

A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.

A dispensing head is disclosed including a control system located in the dispensing head, an encoder read head located in the dispensing head, and a light-capture sensor located in the dispensing head configured to detect a light flash of a stationary camera when the light flash illuminates a component on the dispensing head or an element of the dispensing head. The control system is configured to determine a precise encoder position with the encoder read head at a moment of the light flash. The dispensing head is configured to at least partially assemble an unfinished product. An assembly machine having the dispensing head and a method of at least partially assembling an unfinished product with the dispensing head is further disclosed.

A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

Tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described.

A balloon catheter for providing a 3-dimensional rendering of the interior of a cavity, the catheter system including a controller, a catheter connected to the controller and a balloon positioned on the catheter. The balloon includes a mesh having members extending longitudinally and circumferentially about the balloon where each member of the mesh has an electrical characteristic that changes as the member is deformed. The controller uses a measurement of the variable electrical characteristic to generate a three-dimensional rendering of an interior surface of the cavity, which can be rotating to different viewing angles.

A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.