Y10T29/49169

Manufacturing process for laminated glazing unit

A method of fabrication of a laminated glazing unit, includes cutting out a first through-hole in a first glass sheet; positioning a conducting wire and a film of thermoplastic polymer between the first glass sheet and a second glass sheet so that a first extremity and a second extremity of the conducting wire extend outside the laminated glazing unit to be formed, and feeding out the first extremity of the conducting wire via the first through-hole so that the first extremity exits the laminated glazing unit to be formed via the first through-hole, the conducting wire extending continuously from the first extremity to the second extremity, and after the positioning and feeding out, assembling the conducting wire, the film of thermoplastic polymer, the first glass sheet and the second glass sheet all together to form the laminated glazing.

MICROMECHANICAL DETECTION STRUCTURE OF A MEMS MULTI-AXIS GYROSCOPE, WITH REDUCED DRIFTS OF CORRESPONDING ELECTRICAL PARAMETERS

A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

PRE-CONNECTED ANALYTE SENSORS

Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or wearable equipment.

PRE-CONNECTED ANALYTE SENSORS

Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or wearable equipment.

Pre-connected analyte sensors

Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or wearable equipment.

METHOD OF ASSEMBLY OF ARTICLES AND INTERMEDIATE CREATED THEREBY
20220164621 · 2022-05-26 ·

Articles on flexible webs with different pitches are assembled together by displacing portions between articles of one web out of plane to move the articles on that web to the same pitch as the other web, aligning the two webs to register corresponding articles on the two webs, and assembling the corresponding articles together. The assembly may be used for example in the making of RFID tags, labels and inlays.

Method of assembly of articles and intermediate created thereby
11301739 · 2022-04-12 · ·

Articles on flexible webs with different pitches are assembled together by displacing portions between articles of one web out of plane to move the articles on that web to the same pitch as the other web, aligning the two webs to register corresponding articles on the two webs, and assembling the corresponding articles together. The assembly may be used for example in the making of RFID tags, labels and inlays.

Electrochromic mirror reflective element for vehicular rearview mirror assembly

An electrochromic mirror reflective element for a vehicular rearview mirror assembly includes front and rear glass substrates with an electrochromic medium disposed therebetween and with a fourth surface reflector coated at the fourth surface of the rear substrate. Light incident at the first surface of the front substrate passes (i) through the front substrate, (ii) through a transparent electrically conductive coating at the second surface of the front substrate and (iii) through the electrochromic medium, whereby light passing through the electrochromic medium is partially reflected at a third surface reflector and is partially transmitted through the third surface reflector, and wherein light passing through the electrochromic medium that is partially transmitted through the third surface reflector passes through the rear substrate and is at least partially reflected off the fourth surface reflector at the fourth surface of the rear substrate to provide enhanced reflectivity of said electrochromic mirror reflective element.

HANDHELD DEVICE ENCLOSURE

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

ELECTRONIC MODULE
20210321520 · 2021-10-14 ·

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.