A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.

A solar power conversion kit allows converting of a standard umbrella into a solar charging umbrella, which can then use solar power to charge electronic devices. The solar charging umbrella is self-sustained, capable of charging electronic devices in locations away from electrical outlets. The umbrella has a rechargeable battery that is recharged by sunlight. When charged, the umbrella's battery can charge devices when sunlight is not available. The umbrella supports simultaneous charging of higher power devices such as tablet computers.

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

A method of treating air passing through an air handling unit having a housing extending around an air handling space and a primary air treatment system that treats air as the air passes through the air handling unit between air inlet and outlet locations on the air handling unit. First and second fixtures are obtained, each having a housing and a UV light source. The first and second fixtures are strategically mounted to the air handling unit so that UV light from each of the UV light sources on the first and second fixtures treats air moving through the air handling unit with the UV light sources on the first and second fixtures energized. The first and second fixtures are serially electrically connected to a power source to thereby cause the UV light sources on the first and second fixtures to be energized through the power source.

A camera system for a vehicle includes a camera module having an imager assembly, a main circuit board and a camera housing, with the imager assembly including (i) an imager disposed on an imager circuit board and (ii) a lens assembly having a lens barrel accommodating a lens. A bracket is configured to attach at the vehicle windshield and to receive the camera module. The lens barrel extends from a portion of the lens assembly that is enclosed by the camera housing through an aperture to protrude outside the camera housing. With the camera module received by the bracket and with the bracket attached at the windshield, a forward portion of the camera housing is below the lens barrel. A separate stray light shield is disposed at the forward portion of the camera housing to reduce incidence of stray light at the lens.

A solar power conversion kit allows converting of a standard umbrella into a solar charging umbrella, which can then use solar power to charge electronic devices. The solar charging umbrella is self-sustained, capable of charging electronic devices in locations away from electrical outlets. The umbrella has a rechargeable battery that is recharged by sunlight. When charged, the umbrella's battery can charge devices when sunlight is not available. The umbrella supports simultaneous charging of higher power devices such as tablet computers.

A standoff supporting a control rod drive mechanism (CRDM) in a nuclear reactor is connected to a distribution plate which provides electrical power and hydraulics. The standoff has connectors that require no action to effectuate the electrical connection to the distribution plate other than placement of the standoff onto the distribution plate. This facilitates replacement of the CRDM. In addition to the connectors, the standoff has alignment features to ensure the CRDM is connected in the correct orientation. After placement, the standoff may be secured to the distribution plate by bolts or other fasteners. The distribution plate may be a single plate that contains the electrical and hydraulic lines and also is strong enough to provide support to the CRDMs or may comprise a stack of two or more plates.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.