A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/m.sup.2 per one surface.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The Sn-plated steel sheet of the disclosure is an Sn-plated steel sheet including: a steel sheet; an Sn plating layer formed on at least one side of the steel sheet and containing, based on % by mass, from 0.1 g/m.sup.2 to 15 g/m.sup.2 of metal Sn; and a coating layer formed on the surface of the Sn plating layer and containing zirconium oxide and tin oxide; in which the content of the zirconium oxide in the coating layer is from 0.2 mg/m.sup.2 to 50 mg/m.sup.2 in terms of metal Zr amount, and the peak position of binding energy of Sn3d.sub.5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than the peak position of binding energy of the metal Sn.

A steel sheet for a drawn can has a predetermined chemical composition and has a ferrite single-phase structure with a crystal grain size number of 11.0 or more, the sheet thickness is 0.15 to 0.50 mm, in an L direction of the steel sheet after an ageing treatment at 100 C. for one hour, an yield strength YP is 220 to 290 MPa, a tensile strength TS is 330 to 390 MPa, a total elongation EL is 32% or more, an yield point elongation YP-EL is 0%, an average plastic strain ratio r.sub.m is more than 1.35, and an in-plane anisotropy r is 0.30 to +0.15.

A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

This Sn-plated steel sheet includes: a base plated steel sheet having a steel sheet, and a Sn-plated layer on at least one surface of the steel sheet; and a film layer which contains a zirconium oxide and a tin oxide and is positioned on the base plated steel sheet. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m.sup.2 or more and 15 g/m.sup.2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m.sup.2 or more and 30 mg/m.sup.2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d.sub.5/2 of the tin oxide by X-ray photoelectron spectroscopy in the film layer is within a range of 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is in a range of more than 5.0 mC/cm.sup.2 and 20 mC/cm.sup.2 or less.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like.

A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 m or more and 20 m or less.

The Sn-based alloy plated steel sheet of this disclosure includes: a steel sheet; a composite plating layer formed on at least one side of the steel sheet and including an FeNiSn alloy layer and an island-shaped Sn layer located on the FeNiSn alloy layer; and a coating layer formed on the surface of the composite plating layer and containing zirconium oxide and tin oxide, and the composite plating layer contains a predetermined amount of Ni and a predetermined amount of Sn, a content of the zirconium oxide in the coating layer is from 0.2 mg/m.sup.2 to 50 mg/m.sup.2 in terms of metal Zr amount, and a peak position of binding energy of Sn3d.sub.5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than a peak position of binding energy of the metal Sn.

A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.