A board terminal 1 includes a base material 11 made of a metal material and a plating film 12 covering a surface of the base material 11. The plating film 12 includes an outermost layer 120 having a Sn mother phase 120a and SnPd-based alloy phases 120b dispersed in the Sn mother phase 120a, the Sn mother phase 120a and the SnPd-based alloy phases 120b being present on an outer surface. A Pd content in the outermost layer 120 is not more than 7 atomic %. A board connector 2 includes the board terminal 1 and a housing 20 for holding the board terminal 1.

In some examples, an article including a substrate and a multi-layered coating on at least a portion of the substrate. The multi-layered coating including at least one nano-crystalline layer comprising a metal or a metal alloy and a corrosion resistant layer on the at least one nano-crystalline layer. The nano-crystalline layer defining an average grain size of less than 50 nanometers (nm) and the corrosion resistant layer including at least one of nickel metal, tin metal, zinc metal, cadmium metal, chromium metal, nickel-phosphorus alloy, nickel-sulfur alloy, nickel-boron alloy, nickel-cadmium alloy, nickel-zinc alloy, and tin-zinc alloy.

Provided is a special type of corrosion protection for ceramic thermal insulation layers which is produced by joining hollow aluminum oxide particles and an outer glass layer, which is produced; in particular, by thermal treatment.

Provide is a metal-coated liquid-crystal polymer film that is suitable for microcircuit processing and capable of reducing the transmission loss of circuits. The metal-coated liquid-crystal polymer film comprising: a polymer film comprising a polymer film main body capable of forming an optically anisotropic melt phase; a first metal layer layered on at least one side of the polymer film main body; and a second metal layer layered on the first metal layer, wherein in an analysis of oxygen concentration in a thickness direction using XPS, the average oxygen concentration of the first metal layer is 2.5 atom % or less.

A bi-layer protective coating for a metal component, the bi-layer protective coating comprising a bond coating that is metallurgically fused to a substrate of the metal component, wherein the bond coating comprises one or more rare metals and a top coating that is mechanically bonded to the bond coating, wherein the top coating comprises one or more metal oxides, or one or more metal carbides.

A bi-layer protective coating for a metal component, the bi-layer protective coating comprising a bond coating that is metallurgically fused to a substrate of the metal component, wherein the bond coating comprises one or more rare metals and a top coating that is mechanically bonded to the bond coating, wherein the top coating comprises one or more metal oxides, or one or more metal carbides.