Patent classifications
Y10T428/24314
EXTENSIBLE PAPER AND ITS USE IN THE PRODUCTION OF EXPANDED SLIT PACKAGING WRAP AND VOID FILL PRODUCTS
An extensible slit sheet paper product is produced having an expandable slit pattern that forms open cells upon expansion of the paper product. The paper product is an extensible paper having an extensibility in the range from 1-9% in the machine direction and 1-5% in the cross direction. The expansion produces an array of hexagonal cells. The expanded extensible paper can be used to wrap an object for shipping by wrapping and cushioning the object in the expanded slit sheet material. The extensible, expandable slit sheet paper can be wrapped around itself to produce a void fill product.
Wall sheathing with passive energy dissipation
A corrugated sheet metal wall sheathing for resisting external excitations such as wind or earthquake of light-framed wall structures. The sheathing has sheet profile proportioned to insure the top flutes deform laterally and yield at the end of the flute before the onset of any failure mode. A transverse slot in included in each top flute and adjacent web of the sheathing and spaced at intervals along the length of the sheathing.
STRUCTURE CONSTRUCTED BY SHEET
According to an embodiment of the present disclosure, a structure constructed by a sheet includes a sheet body. The sheet body has a plurality of enclosed paths. A plurality of slits and connection portions are arranged along each enclosed path. Each connection portion is located between two adjacent slits. The sheet body is flexible. In an extended state, the slits form extended openings. At least one extended opening is a symmetric opening, so that the sheet body is extended to form a structure constructed by sheet. The structure constructed by sheet forms a stereoscopic curved surface, and the plurality of connection portions is located on a plurality of contours of the stereoscopic curved surface.
METHOD OF PRODUCING A VENEERED ELEMENT
A method of producing a veneered element, including providing a substrate, applying a sub-layer on a surface of the substrate, applying a veneer layer on the sub-layer, and applying pressure to the veneer layer and/or the substrate, such that at least a portion of the sub-layer permeates through the veneer layer. Also, such a veneered element.
Bead-stiffened composite parts
A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.
Patterned Apertured Webs
A patterned apertured web is disclosed. The patterned apertured web includes a plurality of land areas in the patterned apertured web and a plurality of apertures defined in the patterned apertured web. At least some land areas of the plurality of land areas surround at least some apertures of the plurality of apertures. The patterned apertured web has an Effective Open Area in the range of about 3% to about 30%, according to the Aperture Test herein. The patterned apertured web has a plurality of Interaperture Distances, according to the Aperture Test herein. The Interaperture Distances have a distribution having a median and a mean. The plurality of apertures include a first set of apertures defining a first shape and a second set of apertures defining a second shape.
Laminate substrates having radial cut metallic planes
A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.
Prepregs including UV curable resins useful for manufacturing semi-flexible PCBs
Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
Inside corner trim product
A flexible inside corner trim piece is formed with concave depressions at hinge portions where wings attach to the body. The trim piece can be formed such that wings and a top cap lay flat in plane perpendicular to body or wings and top cap curve at an angle. Hinge portions can be narrow or wide and symmetrical or asymmetrical. The trim piece can be dyed, paintable, or present another decorative surface. The trim piece can include embedded lighting.
Expandable slit-sheet stock material, dunnage conversion system and method for expanding
An improved expandable slit-sheet stock material is configured to aid in temporarily restricting opening of a plurality of slits of the slit-sheet stock material, such as during winding of the unexpanded stock material or during expansion of the stock material. Each slit of the plurality of slits includes one or more un-slit reinforcement portions, such as reinforcement ties, extending fully between opposite longitudinal sides of the slit, and disposed between opposed transverse endpoints of the slit. The reinforcement ties minimize or prevent tearing of the stock material during the winding or expansion. A dunnage conversion system for expanding the slit-sheet stock material includes an expander having a pair of opposed rollers. The rollers engage the stock material to effect breaking of the un-slit reinforcement portions and expansion of the slit-sheet stock material.