Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

There is provided a pressure sensitive adhesive demonstrating adhesion to low energy surfaces which is a radiation-crosslinked mixture of a first component comprising a blend of a nonfunctionalized polysiloxane and a silicate-based tackifier; and a second component comprising a blend of a styrenic block copolymer and a tackifier compatible with the styrenic block copolymer. In some embodiments the weight ratio of nonfunctionalized polysiloxane to styrenic block copolymer.in the mixture is between 0.20 and 1.15. In some embodiments the tackifier compatible with the styrenic block copolymer is a blend of hydrogenated hydrocarbon resin tackifier and terpene-based tackifier in a weight ratio of greater than 0.75 hydrogenated hydrocarbon resin tackifier to terpene-based tackifier.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

The invention relates to an adhesive tape, comprising at least one layer of a first, heat-curable adhesive material and, on one of the surfaces of the heat-curable adhesive material layer, a layer of a second, pressure-sensitive adhesive material, characterized in that the second, pressure-sensitive adhesive material is based on one or more unvulcanized rubbers having a saturated carbon chain of the polymethylene type.

Pressure-sensitive adhesive compositions and articles that include a layer of the pressure-sensitive adhesive compositions are provided. The pressure-sensitive adhesive compositions are particularly well suited for use with substrates that have been considered to have difficult to bond to surfaces such as those routinely encountered in the automotive industry. For example, the pressure-sensitive adhesive can be adhered to clear coat compositions, painted surfaces, and various polymeric materials having low energy surfaces (e.g., surfaces having a surface energy no greater than 35 dynes per centimeter).

Pressure-sensitive adhesive compositions and articles that include a layer of the pressure-sensitive adhesive compositions are provided. The pressure-sensitive adhesive compositions are particularly well suited for use with substrates that have been considered to have difficult to bond to surfaces such as those routinely encountered in the automotive industry. For example, the pressure-sensitive adhesive can be adhered to clear coat compositions, painted surfaces, and various polymeric materials having low energy surfaces (e.g., surfaces having a surface energy no greater than 35 dynes per centimeter).

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.