Embodiments of disk drive head suspensions are described that include a spring metal layer. The spring metal layer includes a base region, support arms extending from the base region, and a slider mounting region. The slider mounting region includes a proximal portion, a distal portion, and a pair of motor openings. The motor openings are configured to receive motors such that the longitudinal axes of the motors are non-parallel with the longitudinal axis of the slider mounting region. The suspensions include traces that include a base portion on the base region of the spring metal layer, a spring metal-unsupported portion extending from the base region to the slider mounting region, and a slider mounting portion extending from the spring metal-unsupported portion onto the slider mounting region. And, the suspensions include an insulating layer between portions of the spring metal layer and the conductor layer.

A piezoelectric element easily and surely forms polymer coatings on peripheral end faces of the piezoelectric element without deteriorating a yield of the piezoelectric element. The piezoelectric element is manufactured by a method including steps of cutting a piezoelectric element out from a base piezoelectric material plate so that peripheral end faces are formed to define a peripheral shape of the piezoelectric element, and forming polymer coatings on at least objective areas of the peripheral end faces of the piezoelectric element by vapor deposition polymerization.

A method of manufacturing a chassis of an HIS includes manufacturing a chassis having a base panel with an upper chassis surface. The method further includes attaching at least one resilient component to the upper chassis surface and that upwardly presents an adhesive surface to fixedly engage and to provide vibration damping for a storage drive that is inserted on the adhesive surface during assembly of the IHS.

A disk drive head suspension or flexure and method of manufacture. Embodiments include a portion such as a terminal pad or flying lead comprising a base layer, a dielectric layer on the base layer, a conductor layer, a seed layer between the dielectric layer and the conductor layer, and a noncorrosive metal layer on the seed layer side of the conductor layer. The seed layer has a strip that extends beyond the edge of the dielectric layer. The noncorrosive metal layer extends over the strip of the seed layer and into contact with the edge of the dielectric layer.

Embodiments of disk drive head suspensions are described that include a spring metal layer. The spring metal layer includes a base region, support arms extending from the base region, and a slider mounting region. The slider mounting region includes a proximal portion, a distal portion, and a pair of motor openings. The motor openings are configured to receive motors such that the longitudinal axes of the motors are non-parallel with the longitudinal axis of the slider mounting region. The suspensions include traces that include a base portion on the base region of the spring metal layer, a spring metal-unsupported portion extending from the base region to the slider mounting region, and a slider mounting portion extending from the spring metal-unsupported portion onto the slider mounting region. And, the suspensions include an insulating layer between portions of the spring metal layer and the conductor layer.

A drive carrier includes a latch wire, and a track that includes first and second segments. The latch wire is configured to move along a channel in the track to enable a handle of the drive carrier to transition between multiple positions within the track. The first segment is to be placed in physical communication with the latch wire while the latch wire is at a first position and a second position within the track. The second segment is in physical communication with the first segment. The second segment is to transition between a misaligned position and an aligned position with respect to the first segment, and the latch wire is to transition from the second position to a third position within the track in response to the second segment being in the aligned position.

An information handling system (IHS) includes user selectable compute components including a storage drive. A chassis includes a base panel having an upper chassis surface. At least one resilient component is coupled to the upper chassis surface. An upwardly presented adhesive surface on one or more of the at least one resilient component can fixedly engage and provide vibration damping for a vibration-susceptible compute component that is inserted during provisioning or later modification or repair of the IHS.

A disk drive head suspension or flexure and method of manufacture. Embodiments include a portion such as a terminal pad or flying lead comprising a base layer, a dielectric layer on the base layer, a conductor layer, a seed layer between the dielectric layer and the conductor layer, and a noncorrosive metal layer on the seed layer side of the conductor layer. The seed layer has a strip that extends beyond the edge of the dielectric layer. The noncorrosive metal layer extends over the strip of the seed layer and into contact with the edge of the dielectric layer.

A data storage device involves inner surfaces of sidewalls of a second cover overlapping with and adhesively bonded with the outer surfaces of sidewalls of an enclosure base having an uppermost top surface, where the second cover or an underlying first cover are removably adhered to the uppermost top surface of the base. The removable adhesive bond may comprise a pressure-sensitive adhesive, which can provide for reworkability during the manufacturing and testing process. The second cover-to-base sidewall bond may form a hermetic seal between the second cover and the base. Hence, a thinner base sidewall adjacent to the recording disks is enabled, leaving more space available for larger-diameter recording disks within a standard form factor, hermetically-sealed storage device, which may be filled with a lighter-than-air gas.

A data storage device involves inner surfaces of sidewalls of a second cover overlapping with and adhesively bonded with the outer surfaces of sidewalls of an enclosure base having an uppermost top surface, where the second cover or an underlying first cover are removably adhered to the uppermost top surface of the base. The removable adhesive bond may comprise a pressure-sensitive adhesive, which can provide for reworkability during the manufacturing and testing process. The second cover-to-base sidewall bond may form a hermetic seal between the second cover and the base. Hence, a thinner base sidewall adjacent to the recording disks is enabled, leaving more space available for larger-diameter recording disks within a standard form factor, hermetically-sealed storage device, which may be filled with a lighter-than-air gas.