Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.

A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

The present invention relates a setting method for a conducting element of an electrochemical test strip and electrochemical test strip thereof. An inspection body is formed by injection molding polymer plastic materials to coat with the plurality of conducting elements, and an external contact surface on an information outputting end of the conducting element is exposed from an inspection slot of the inspection body, so that the information outputting end of the conducting element is extended from the inspection body. Eventually, the information outputting end is bent to fix on a surface of the inspection body. The present invention is not complex and has more precision and convenience, and the manufacturing cost can be reduced efficiently, so that wide application can be expected in the near future.

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

An LED light engine includes a housing, one or more LEDs mounted on a printed circuit board and a retention feature engaged with the housing. The retention feature includes one or more of a torsion spring and a friction clip and is configured to engage an inside wall of a recessed lighting can, thereby retaining the LED light engine within the can. The LED light engine may also include a reflector and a lens retained within the housing, with the housing, reflector and lens forming a sealed chamber for protecting the LED components from external environmental conditions. Methods for retrofitting an existing recessed downlight fixture with an LED light engine include removing the existing light engine from the recessed lighting can and inserting an LED light engine into the can.

A method for manufacturing a flexible display device by forming a flexible base substrate on a carrier substrate, the flexible base substrate having a display region and a non-display region, forming a display unit comprising a plurality of pixels at the display region, separating the flexible base substrate from the carrier substrate, forming an adhesive layer under the flexible base substrate, forming a flexible carrier film under the adhesive layer, forming a pressed region of the adhesive layer by partially pressing the adhesive layer, and mounting a driving circuit at a portion of the non-display region overlapping the pressed region.

A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged.

A device comprising a circuit board, said circuit board having a plurality of LEDs dispose on said circuit board, and a chassis, said chassis having a plurality of baffles, each baffle formed by bending a portion of the chassis substantially orthogonally to the surface of the chassis leaving a plurality of holes in said chassis, said holes spaced substantially the same spacing as the plurality of LEDs. The baffles may operate to shield light emitted from the LEDs to either 30 degrees, 45 degrees or 60 degrees. Also included is a housing operable to secure the circuit board and chassis into a fixed position.