A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

A dual-aperture zoom camera comprising a Wide camera with a respective Wide lens and a Tele camera with a respective Tele lens, the Wide and Tele cameras mounted directly on a single printed circuit board, wherein the Wide and Tele lenses have respective effective focal lengths EFL.sub.W and EFL.sub.T and respective total track lengths TTL.sub.W and TTL.sub.T and wherein TTL.sub.W/EFL.sub.W>1.1 and TTL.sub.T/EFL.sub.T<1.0. Optionally, the dual-aperture zoom camera may further comprise an optical OIS controller configured to provide a compensation lens movement according to a user-defined zoom factor (ZF) and a camera tilt (CT) through LMV=CT*EFL.sub.ZF, where EFL.sub.ZF is a zoom-factor dependent effective focal length.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Ultrasound imaging tools are configured with rotation and deflection control. Methods of controlling an ultrasound imaging transducer may include advancing a distal end region of a catheter assembly to an anatomical region of interest, the catheter assembly may include a rotatable shaft carrying an ultrasound imaging transducer; and a deflectable shaft. Actuating a first actuator of a handle assembly may cause rotational movement of the rotatable shaft relative to the deflectable shaft, which thereby causes rotational movement of the ultrasound imaging transducer; and actuating a second actuator of the handle assembly to cause deflection of the deflectable shaft, where the handle assembly includes a handle body with an outer surface that can be gripped by a user, and where the first actuator and the second actuator are circumferentially disposed about a longitudinal axis of the handle body.

A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A method and system of assembling hairpin conductors with a stator core, the system and method including: arranging the plurality of hairpin conductors into two or more sub-assembly fixtures, wherein the plurality of hairpin conductors are arranged in the two or more sub-assembly fixtures in two or more layers; activating a retaining mechanism to hold the plurality of hairpin conductors in place within the sub-assembly fixtures; meshing the two or more sub-assembly fixtures together to bring the hairpin conductors into alignment and form a layered conductor assembly; introducing the layered conductor assembly into the stator core by advancing the two or more sub-assembly fixtures in relation to the stator core in alignment with the locations on the stator core for the layered conductor assembly; and at an appropriate timing, deactivating the retaining mechanism to release the layered conductor assembly from the two or more sub-assembly fixtures.

A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.