Pre-distorted transmitters operable over a wide range of frequencies including a plurality of predetermined frequency bands are provided. The transmitters include a programmable digital up-converter and a programmable digital down-converter, an ADC, a DAC, a power amplifier and at least one analog filter arranged along a transmit signal path and a feedback signal path.

A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.

A method of manufacturing package structure with following steps is disclosed herein. An insulating composite layer is formed on a metal layer of a carrier board. A chip packaging module including a sealant and a first chip embedded therein is disposed on the insulating composite layer, in which the first chip has a plurality of conductive pads. A first circuit layer module including a dielectric layer and a circuit layer is formed on the chip packaging module, in which the circuit layer is on the dielectric layer and electrically connected to the conductive pads through a conductive vias in the dielectric layer. A second chip is disposed on the first circuit layer module. A second circuit layer module is formed on the first circuit layer module and the second chip. A protecting layer is formed on the second circuit layer module.

A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

The present invention relates to an area-saving driving circuit for a display panel, which comprises a plurality of digital-to-analog converting circuits convert input data, respectively, and produce a pixel signal. A plurality of driving units are coupled to the plurality of digital-to-analog converting circuits, respectively. They produce a driving signal according to the pixel signal and transmit the driving signal to the display panel for displaying. A plurality of voltage booster units are coupled to the plurality of driving units, respectively, and produce a supply voltage according to a control signal. Then the supply voltage is provided to the plurality of driving units. Thereby, by providing the supply voltage to the plurality of driving units of the display panel by means of the plurality of voltage booster units, the area of the external storage capacitor is reduced. Alternative, the external storage capacitor can be even not required.

A top case assembly for a portable computer is disclosed. The assembly may include an integral unified (e.g., homogenous) top case formed from a single part. The integral top case provides an enclosure, frame and cosmetic exterior of the portable computer. The integral top case also serves as the primary structure of the portable computer. The assembly may include a variety of subassemblies such as keyboards, touchpads, circuit boards, and drives that are carried by the underside of the integral top case. The integral top case may be formed from aluminum slab that has been machined to form walls, openings, attachment areas and cosmetic areas of the top case.

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.

Aspects of the disclosure relate to a lighting assembly and method for illuminating a vertical planar area, such as a merchandise display. The lighting assembly can comprise two opposing support arms and a lighting bar extending between the two opposing support arms, a circuit board having a plurality of LEDs mounted to the inside of the lighting bar; and a plurality of reflective surfaces located adjacent to the plurality of LEDs, wherein the plurality of reflective surfaces are positioned such that the LEDs project a first light beam in a first direction and a second light beam in a second direction different than the first direction.

Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described.

A mobile wireless communications device includes a housing and circuit board carried by the housing and includes radio frequency (RF) circuitry and a processor carried by the circuit board and operative with each other. A display connector for an LCD connector is mounted on the circuit board and adapted to be connected to a display. Display connection lines are carried by the circuit board and interconnect the display connector and processor for carrying signals from the processor to the display connector and a connected display. Filters are carried by the circuit board and connected to the display connection lines and reduce any interfering energy from the processor and display.