There is provided a method for producing a liquid transport apparatus includes: a pressure chamber plate partially defining a pressure chamber that communicates with a nozzle for ejecting liquid; an insulating ceramics layer located on a surface of the pressure chamber plate to cover the pressure chamber; a piezoelectric layer located on the insulating ceramics layer; and a first electrode located on the piezoelectric layer. The method includes: forming the insulating ceramics layer on the pressure chamber plate by heating an insulating ceramic material; forming the piezoelectric layer and the first electrode on the insulating ceramics layer; forming the piezoelectric layer including annealing the piezoelectric layer at the annealing temperature; and forming the pressure chamber by removing a part of the pressure chamber plate so that a part of the insulating ceramics layer is exposed on the pressure chamber.

Embodiments described herein involve methods of forming an interactive card with indicators on a substrate. A plurality of indicators are formed on the substrate by way of a printed electronics process. A plurality of displaceable regions of piezoelectric material are formed on the substrate by way of a printed electronics process. Electrical interconnections are formed on the substrate by way of a printed electronics process, the electrical interconnections connecting an indicator and an associated displaceable region of piezoelectric material such that displacement of the associated displaceable region of piezoelectric material generates a voltage therein that is provided to the indicator in order to actuate the indicator and thereby indicate displacement of the associated displaceable region of piezoelectric material.

A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.

Provided are a gas sensor and a method of manufacturing the same. The gas sensor may include a transition metal chalcogenide layer on a substrate, a metal nano material on the transition metal chalcogenide layer, and an electrode on the transition metal chalcogenide layer with the metal nano material.

Block components having a conductive property are mounted on lands for connection to a harness so as to increase the height of the lands on a circuit board which is to be connected to windings.

A touch screen includes a plurality of first transparent electrodes extending in a first direction and a plurality of second transparent electrodes extending in a second direction intersecting the first direction disposed on the substrate; first conductive layers located on at least one side of the first transparent electrodes and connected in parallel with the first transparent electrodes; and/or second conductive layers located on at least one side of the second transparent electrodes and connected in parallel with the second transparent electrodes; the first conductive layers and the second conductive layers are metal layers or alloy layers. A manufacturing method of the touch screen and a display device having the touch screen are further disclosed.

This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer.

This disclosure provide a nanopillar electrode device, comprising a substrate patterned with a plurality of metal pads. The device may further comprise a plurality of nanopillars electrode arrays, wherein each nanopillar electrode array is attached to the substrate above a metal pad and electrically connected to the pad. The device may further comprise and a chamber surrounding the nanopillar electrodes, which can be used for culturing cells of interest for recording action potentials. The nanopillar electrode device may be configured to apply a voltage through the nanopillar electrodes from a voltage source. Nanopillar electroporation may be used to increase the permeability of cell membranes to allow intracellular recording. Also provided are methods of device fabrication, and methods of use.