Method for interfacing an integrated circuit with a biological ion channel, the integrated circuit being at least partially disposed within an electrolytic solution and including an amplifier and one or more electrodes on a surface thereof, includes forming one or more microwells proximate the one or more electrodes, applying a lipid membrane over the integrated circuit proximate the microwells, and placing a further electrode in the electrolytic solution proximate the lipid membrane on a side opposite the integrated circuit. A biological ion channel interface is also provided.

A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.

A catheter or other elongated member can include an elongated inner portion, an elongated outer portion, a flex circuit ribbon comprising at least one conductor, and an electrical contact. The flex circuit ribbon can be situated between the inner portion and the outer portion. The inner portion and the outer portion can be (1) affixed together between portions of the flex circuit ribbon or (2) integrally formed such that masses of the inner and outer portions are joined together between portions of the flex circuit ribbon. The electrical contact can be configured to be exposed during use. The electrical contact can be situated at, or connected to, the at least one conductor of the flex circuit ribbon.

A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

A textile-based electrode system includes a first fabric layer having an inner and an outer surface. The inner surface includes a knitted electrode configured to be placed in contact with the skin of a user. A second fabric layer is disposed and configured to contact the outer surface of the first fabric layer. The second fabric layer includes a knitted conductive pathway configured to be electrically coupled to the knitted electrode. Furthermore, a third fabric layer is configured and disposed to contact the second fabric layer. A connector is disposed on the third fabric layer and is configured to be electrically coupled to the knitted conductive pathway. The second fabric layer can be folded about a first fold axis and the third fabric layer can be folded about a second fold axis to place the second fabric layer in contact with the first fabric layer and the third fabric layer.

The neural interface system of one embodiment includes a cylindrical shaft, a lateral extension longitudinally coupled to at least a portion of the shaft and having a thickness less than a diameter of the shaft, and an electrode array arranged on the lateral extension and radially offset from the shaft, including electrode sites that electrically interface with their surroundings. The method of one embodiment for making the neural interface system includes forming a planar polymer substrate with at least one metallization layer, patterning on at least one metallization layer an electrode array on a first end of the substrate, patterning conductive traces on at least one metallization layer, rolling a portion of the substrate toward the first end of the substrate, and securing the rolled substrate into a shaft having the first end of the substrate laterally extending from the shaft and the electrode array radially offset from the shaft.

An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface.

Microelectronic assemblies and methods of making the same are disclosed. In some embodiments, a microelectronic assembly includes a microelectronic element having edge surfaces bounding a front surface and contacts at the front surface; rigid metal posts disposed between at least one edge surface and a corresponding edge of the assembly, each metal post having a sidewall separating first and second end surfaces, the sidewalls have a root mean square (rms) surface roughness of less than about 1 micron; a encapsulation contacting at least the edge surfaces and the sidewalls; an insulation layer overlying the encapsulation; connection elements extending through the insulation layer, wherein at least some connection elements have cross sections smaller than those of the metal posts; a redistribution structure deposited on the insulation layer and electrically connecting first terminals with corresponding metal posts through the first connection elements, some metal posts electrically coupled with contacts of microelectronic element.

A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on the insulator polymer base layer; b) applying a layer of photoresist on the metal trace layer and patterning the metal trace layer and forming metal traces on the insulator polymer base layer; c) activating the insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with the base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of the insulator polymer layer and selective etching the insulator layer and the top coating layer to obtain at least one via; and e) filling the via with electrode material.

A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.

The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.

A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.