Embodiments described herein involve methods of forming an interactive card with indicators on a substrate. A plurality of indicators are formed on the substrate by way of a printed electronics process. A plurality of displaceable regions of piezoelectric material are formed on the substrate by way of a printed electronics process. Electrical interconnections are formed on the substrate by way of a printed electronics process, the electrical interconnections connecting an indicator and an associated displaceable region of piezoelectric material such that displacement of the associated displaceable region of piezoelectric material generates a voltage therein that is provided to the indicator in order to actuate the indicator and thereby indicate displacement of the associated displaceable region of piezoelectric material.

A touch panel is provided. The touch panel includes a substrate, a jumper metal, a first insulation layer, first and second conductive patterns, first and second metal electrodes, and a second insulation layer. The jumper metal is formed on the substrate. The first insulation layer includes an opening and is formed on the jumper metal. The first and second conductive patterns are formed on the first insulation layer. The first and second metal electrodes are respectively connected to end portions of the first and second conductive patterns. The second insulation layer is formed on the first and second conductive patterns and the first and second metal electrodes. One of the first and second conductive patterns is connected by the jumper metal exposed through the opening of the first insulation layer.

Systems and methods for improved chip device performance are discussed herein. An exemplary chip device for use in an integrated circuit comprises a bottom and a top opposite the bottom. The chip device comprises a through-chip device interconnect and a clearance region. The through-chip device interconnect is configured to provide an electrical connection between a ground plane trace on the bottom and a chip device path on the top of the chip device. The clearance region on the bottom of the chip device comprises an electrically conductive substance. The size and shape of the clearance region assists in impedance matching. The chip device path on the top of the chip device may further comprise at least one tuning stub. The size and shape of the at least one tuning stub also assists in impedance matching.

A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.

The subject matter disclosed herein relates to an electrowetting display comprising: a transparent substrate including glass spacers surrounded by recessed regions corresponding to pixel regions, a layer of transparent conductive material on the glass spacers, color filter material in the recessed regions, and a transparent support plate covering the recessed regions and the glass spacers, wherein the transparent support plate includes an electrowetting oil.

An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

A biosensor is proposed for insertion into the subcutaneous tissue of a user wherein the biosensor includes at least one flexible substrate (2) and at least one electrode (5) on at least one surface (9) of the substrate and at least one contacting element (3). The contacting element is connected to the electrode. The substrate has at least one kink (4), at which the substrate is at least partly kinked such that the surface is subdivided into at least two interconnected outer surfaces (9a, 9b, 9c).

A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial wiring part that is on a space separated from the metal substrate. The base insulating layer of the aerial wiring part is formed to be thinner than that of the normal wiring part. This configuration reduces a rigidity contribution ratio of the wiring part.