A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

In an electronic component, an outer electrode includes a sintered layer including a sintered metal, a reinforcement layer not containing Sn but including Cu or Ni, an insulation layer, and a Sn-containing layer. The sintered layer extends from each end surface of an element assembly onto at least one main surface thereof to cover each end surface of the element assembly. The reinforcement layer extends on the sintered layer and covers the sintered layer entirely. The insulation layer is directly provided on the reinforcement layer at each end surface of the element assembly, extends in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the reinforcement layer except for a portion of the reinforcement layer that is covered by the insulation layer, and defines another portion of the surface of the outer electrode.

A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

A pressure contact type connector includes: an upper flat plate portion; a lower flat plate portion which is disposed below the upper flat plate portion; a first spring portion which connects the upper and lower flat plate portions; and a second spring portion which extends upward from the lower flat plate portion and applies a resilient force to the upper flat plate portion, in which the first and second spring portions are wound about the upper flat plate portion when viewed from above in a plan view, and extend so that the spring portions do not interfere with each other when being compressed and extended in the vertical direction, the first spring portion is formed to be bent so that a width dimension is larger than a thickness dimension, and the second spring portion is formed to be bent so that a width dimension is larger than a thickness dimension.

One aspect provides an implantable medical device with a housing having an opening with an opening width. A feedthrough is provided, including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width. A sinter joint is between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator to the housing without an intervening ferrule.

One aspect provides an implantable medical device with a housing having an opening with an opening width. A feedthrough is provided, including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width. A sinter joint is between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator to the housing without an intervening ferrule.

One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes applying a sinter paste onto a surface of the housing about a perimeter of an opening through the housing, the sinter paste including a biocompatible bonding material, and placing an insulator of the feedthrough onto the sinter paste so as to cover the opening. The sinter paste is then heated to a temperature less than a beta-transus temperature the titanium of the housing and to a temperature less than a melting point of the biocompatible bonding material for a desired duration to form, from the sinter paste, a sinter joint which bonds the feedthrough to the housing and hermetically seals the opening.

A method for manufacturing an electrical bushing including at least one electrically insulating base body of a ceramic compound and at least one electrical conducting element, the conducting element comprising at least one cermet and, at least in part, is hermetically sealed with respect to the base body. The method includes manufacturing the at least one base body and introducing the at least one conducting element into the base body in non-sintered or pre-sintered condition. The base body and conducting element are joint sintered. The same ceramic compound is used for the cermet of the conducting element and for the base body.

An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.