Patent classifications
Y10T29/49224
Methods of making Z-shielding
Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect. the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.
Implantable nerve electrode and method for producing an implantable nerve electrode
The invention relates to an implantable nerve electrode (1) that comprises an electrically insulating substrate (2) with conductor traces (3) running therein, electrode contacts (4) and connection contacts (5), wherein the conductor traces (3) connect the electrode contacts (4) to the connection contacts (5), and wherein the electrode contacts (4) can be connected to the nerves of a nervous system, each of the conductor traces (3) having an at least partial sheathing (13) made of a polymer that is mechanically strong and a good insulator. The invention further relates to a method for producing an implantable nerve electrode (1).
Mid-scalar electrode array
In one example, a cochlear lead includes a flexible body, an array of electrodes in the flexible body, and a plurality of wires passing along the array of electrodes. The plurality of wires includes a flexural geometry between each pair of adjacent electrodes and a substantially straight geometry over the electrodes. A method for forming an electrode array with a reduced apical cross section is also provided.
Potential equalization in a control device for a motor vehicle
An arrangement for potential equalization in a control device for a motor vehicle includes at least one electrical component on a circuit carrier, a carrier structure on which the circuit carrier is arranged, and at least one contacting element that electroconductively connects the circuit carrier to the carrier structure by way of a connecting element that forms a potential equalization. The contacting element has a bondable surface coating.
METHOD FOR FORMING NEGATIVE ELECTRODE AND METHOD FOR MANUFACTURING LITHIUM SECONDARY BATTERY
The number of steps is reduced in the formation process of an electrode. Deterioration of the electrode is suppressed. A highly reliable lithium secondary battery is provided by suppressing the deterioration of the electrode. A method for forming a negative electrode and a method for manufacturing a lithium secondary battery including the negative electrode are provided. In the method for forming the negative electrode, graphene oxide, a plurality of particulate negative electrode active materials, and a precursor of polyimide are mixed to form slurry; the slurry is applied over a negative electrode current collector; and the slurry applied over the negative electrode current collector is heated at a temperature higher than or equal to 200 C. and lower than or equal to 400 C. so that the precursor of the polyimide is imidized. The graphene oxide is reduced in heating the slurry to imidize the precursor of the polyimide.
Twisted leak detection cable
Disclosed is a leak detection cable that has an outer jacket layer and a four wire construction in a flat wire configuration that is twisted in a helix. Detection cables are disposed on the exterior surface adjacent openings of the jacket to allow for detection of aqueous fluids. The wire is twisted in a helix to allow adjacent detector wires to easily detect aqueous fluids. Disparate materials are used for the jacket and the coatings of the wires, to allow the jacket to be easily removed from the wires without affecting the integrity of the coatings of the wires. The four flat wire configuration is sized and spaced for easy connection to an insulation displacement connector.
Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
Method for forming negative electrode and method for manufacturing lithium secondary battery
The number of steps is reduced in the formation process of an electrode. Deterioration of the electrode is suppressed. A highly reliable lithium secondary battery is provided by suppressing the deterioration of the electrode. A method for forming a negative electrode and a method for manufacturing a lithium secondary battery including the negative electrode are provided. In the method for forming the negative electrode, graphene oxide, a plurality of particulate negative electrode active materials, and a precursor of polyimide are mixed to form slurry; the slurry is applied over a negative electrode current collector; and the slurry applied over the negative electrode current collector is heated at a temperature higher than or equal to 200 C. and lower than or equal to 400 C. so that the precursor of the polyimide is imidized. The graphene oxide is reduced in heating the slurry to imidize the precursor of the polyimide.
Methods for integrated circuit fabrication with protective coating for planarization
Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.
Method of assembling sealant containing twist-on wire-connectors
An improved method of making sealant containing twist-on wire connectors from a batch of components, wherein some of the components may be preassembled through automated equipment and at least one or more of the steps performed in the making of a sealant containing twist-on wire connector is performed manually at a station where an operator can simultaneously perform one or more steps to enhance the formation of a twist-on wire connector containing a sealant while at the same time eliminating upfront investments costs for a work station as well as costs for maintenance of a work station.