The present invention relates to a metal substrate for a fixing belt, having excellent durability. The metal substrate for a fixing belt of the present invention including an austenite stainless steel including a martensite phase includes: a region of austenite stainless steel including a martensite phase, with a nickel content of 8 mass % or more, sandwiched between regions of austenite stainless steel including a martensite phase, with a nickel content less than 8 mass %, in the thickness direction.

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.

Certain example embodiments relate to Ni-inclusive ternary alloy being provided as a barrier layer for protecting an IR reflecting layer comprising silver or the like. The provision of a barrier layer comprising nickel, chromium, and/or molybdenum and/or oxides thereof may improve corrosion resistance, as well as chemical and mechanical durability. In certain examples, more than one barrier layer may be used on at least one side of the layer comprising silver. In still further examples, a Ni.sub.xCr.sub.yMo.sub.z-based layer may be used as the functional layer, rather than or in addition to as a barrier layer, in a coating.

Provided are reflective thin film constructions including a reduced number of layers, which provides for increased solar-weighted hemispherical reflectance and durability. Reflective films include those comprising an ultraviolet absorbing abrasion resistant coating over a metal layer. Also provided are ultraviolet absorbing abrasion resistant coatings and methods for optimizing the ultraviolet absorption of an abrasion resistant coating. Reflective films disclosed herein are useful for solar reflecting, solar collecting, and solar concentrating applications, such as for the generation of electrical power.

Certain example embodiments relate to Ni-inclusive ternary alloy being provided as a barrier layer for protecting an IR reflecting layer comprising silver or the like. The provision of a barrier layer comprising nickel, chromium, and/or molybdenum and/or oxides thereof may improve corrosion resistance, as well as chemical and mechanical durability. In certain examples, more than one barrier layer may be used on at least one side of the layer comprising silver. In still further examples, a Ni.sub.xCr.sub.yMo.sub.z-based layer may be used as the functional layer, rather than or in addition to as a barrier layer, in a coating.

Provided is a shielding label comprising: a shield layer; a cover layer disposed on a first side of the shield layer, and a removable adhesive layer disposed on at least a portion of a second side of the shield layer, wherein the shield layer provides electro-magnetic shielding characteristics so as to prevent the exchange of data between an RFID article adjacent the shielding label and an external device when the component is located in the read range of the external device.

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Certain example embodiments relate to Ni-inclusive ternary alloy being provided as a barrier layer for protecting an IR reflecting layer comprising silver or the like. The provision of a barrier layer comprising nickel, chromium, and/or molybdenum and/or oxides thereof may improve corrosion resistance, as well as chemical and mechanical durability. In certain examples, more than one barrier layer may be used on at least one side of the layer comprising silver. In still further examples, a Ni.sub.xCr.sub.yMo.sub.z-based layer may be used as the functional layer, rather than or in addition to as a barrier layer, in a coating.

A laminate may include the following layers in order: a transparent substrate, a first dielectric layer, a silver layer, a light-absorbing layer, a first barrier layer, and a second dielectric layer. The first dielectric layer may be in contact with the transparent substrate, and a single silver layer may be present in the laminate between the first dielectric layer and the second dielectric layer.

A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.