A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 m provides a strength ratio of 1.6 or less.

A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 m or more and 1.3 m or less.

Coated articles and methods for applying coatings are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating may, in some instances, include at least two layers. For example, the coating may include a first layer comprising a silver-based alloy and a second layer comprising a precious metal. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

An electroless waterless silver plating ink process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver salt, an ammonium salt and dimethyl sulfoxide.

Techniques for graphic formation via material ablation described. In at least some implementations, a graphic is applied to a surface of an object by ablating layers of the object to form an ablation trench in the shape of the graphic. In at least some embodiments, an object can include a surface layer and multiple sublayers of materials. When an ablation trench is generated in the object, the ablation trench can penetrate a surface layer of the object and into an intermediate layer. In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same colored coating.

The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass % to 15.0 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.05 mass % to less than 1.00 mass % of Ni; 0.001 mass % to less than 0.100 mass % of Fe; 0.005 mass % to 0.100 mass % of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002Fe/Ni<1.500, 3.0<(Ni+Fe)/P<100.0, and 0.10<Sn/(Ni+Fe)<5.00 were satisfied by atomic ratio, and a yield ratio YS/TS is more than 90% which is calculated from a strength TS and a 0.2% yield strength YS when a tensile test is performed in a direction parallel to a rolling direction.

There is provided a seamless steel pipe for line pipe, wherein a chemical composition consists, by mass percent, of C: 0.03-0.10%, Si: 0.50%, Mn: 1.0-2.0%, P: 0.050%, S: 0.005%, Cr: 0.05-1.0%, Mo: 0.01-0.30%, Al: 0.001-0.10%, N: 0.01%, Ni: 0.04-2.0%, Ca: 0.0005-0.0050%, Cu: 0-2.0%, Ti: 0-0.05%, Nb: 0-0.05%, V: 0-0.10%, the balance: Fe and impurities, and satisfies the conditions of Cu+Ni: 0.10%, and Mo+V: 0.30%, wherein in a scale formed on the surface of the steel pipe, metal particles consisting mainly of Ni or Cu having an average circle-equivalent diameter of 0.1-5 m exist, and a distance from a boundary between the base metal of the steel pipe and the scale to a region in which the metal particles do not exist is 20 m or longer.

There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.

A black plated resin part includes a resin base material, an underlying plating layer including a copper plating layer and a nickel plating layer formed in this order on the resin base material, a black chromium plating layer formed on the nickel plating layer, formed of trivalent chromium, and having a film thickness of not less than 015 m, and a corrosion resistant film formed on the black chromium plating layer, formed of chromic phosphate or molybdenum phosphate, and having a film thickness of not less than 7 nm. A brightness of the black chromium plating layer seen through the corrosion resistant film is expressed by an L* value of not more than 54 based on the L*a*b* color system.

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.