Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.

A metallic foil for lightning strike protection in a composite aerospace structure having a length, a width, and a thickness of not more than 30 microns. There are a plurality of pores of a predefined geometric shape extending through the thickness of the metallic foil and being distributed across a surface area defined by the length and the width of the metallic foil. The plurality of pores in the aggregate define an open area of not more than 40% of the surface area and the metallic foil has a weight of not more than 115 g/m.sup.2. The metallic foil has a weight to conductivity ratio of not more than 0.40 gram-ohms per square.

This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 g/dm.sup.2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 g/dm.sup.2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.

The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble metallic bonding landing pad from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a CuSn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the CuSn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu.sub.6Sn.sub.5 alloy with Ni; and parts of the CuSn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 m to 0.6 m (inclusive); and an area rate of the exposed portions of the CuSn alloy layer relative to a surface area of is 1% to 40% (inclusive).

A galvannealed steel sheet includes a plating layer containing 7.2-10.6 mass % of Fe, 0.2-0.4 mass % of Al, and 0.1 mass % or more of at least one of Ni, Co, Cu, and In, and the balance of Zn and impurities. In a vertical cross-section of the plating layer, an average thickness of a phase is 0.2 m or less, and an average thickness of a phase is 0.5 m or less. In the phase, at least one of Ni, Co, Cu, and In are contained at a ratio in the phase of 0.5 mass % or more. A phase existing in contact with the phase is a mixed phase of .sub.1 phase and phase, and a phase percentage defined by ( phase/ phase contact interface length)/( phase/ phase contact interface length+.sub.1 phase/ phase contact interface length)100 is 10% or more.

Provided is a production method for a layered product in which a metal film can be formed on the surface of a polyarylene sulfide (PAS) molded article with a high adhesive force by a simple step. Further, provided are: a polyarylene sulfide resin composition and a molded article that can be used in the layered product in which a metal film can be formed on the surface of the PAS molded article with a high adhesive force by a simpler step; and production methods therefor. More specifically, provided are: a polyarylene sulfide resin composition obtained by blending a polyarylene sulfide resin, a thermoplastic elastomer and/or a hydrolyzable thermoplastic resin, a carbonate, and a polyolefin-based wax; a molded article which is obtained by melt-molding the polyarylene sulfide resin composition and in which the surface is roughened; a layered product having a metal plating layer; and production methods therefor.

A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.