To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

Provided is a plating film containing Au and Tl, including Tl oxides including Tl.sub.2O on a surface of the plating film, a ratio of Tl atoms constituting Tl.sub.2O to a total of Tl atoms constituting the Tl oxides and Tl atoms constituting Tl simple substances on the surface being 40% or more.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like.

A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 m or more and 20 m or less.

The present invention discloses a metal composite wire capable of increasing a tightness degree of copper-aluminum bonding. The metal composite wire includes a metal core rod. Continuous spiral grooves are formed in a surface of the core rod The core rod is cladded with a metal cladding layer with higher electrical conductivity than the core rod. An average depth of the continuous spiral grooves 1/10 of a thickness of the metal cladding layer. By setting the thickness of the metal cladding layer as t.sub.1, a specific gravity of the metal cladding layer as.sub.1, a diameter of the core rod as R, the average depth of the continuous spiral grooves as h, and a specific gravity of the core rod as .sub.2,

[00001]$t_1=\sqrt{\frac{{\left(R-h\right)}^2{}_1+k{\left(R-h\right)}^2{}_2-k{\left(R-h\right)}^2{}_1}{\left(1-k\right){}_1}}+h-R.Math..Math.\mathrm{and}$$0.2k0.7.$

The metal composite wire of the present invention can be widely applied to cable conductors and cable shielding braiding layers.

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 m, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 mol/dm.sup.2, and a total adhesion amount of the B element group is 40 to 900 mol/dm.sup.2.

A friction material comprises an Fe part which contains Fe as a main component, a coating layer formed on a surface of the Fe part, and a friction part formed on a surface of at least a part of the coating layer, and the coating layer comprises a first coating layer and a second coating layer which have a specific average thickness and a specific component in order from Fe part side, and in the second coating layer, in order of positions at which the thickness is 20%, 40%, 60% and 80% of the second coating layer from the side of the first coating layer to the side opposite thereto, a Cu content increases and a Ni content decreases.

A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.

A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.

The present invention relates to metal coatings and methods thereof. In certain embodiments, the invention relates to ultra-low wear noble metal alloys, such as for use in electrical contact coatings.

A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6:
Strength ratio=ultimate strength/0.2% offset yield strength.(1)