A method of assembling an antenna aperture from a plurality of antenna aperture segments is described. The method may include placing a first aperture segment relative to a second aperture segment to partially form the antenna aperture. Furthermore, an overlap of the first aperture segment overlaps a complementary underlap of the second aperture segment at a seam. The method may also include joining the overlap of the first aperture segment to the underlap of the second aperture segment to partially form the antenna aperture.

A computer automatic assembly system is proposed. The computer automatic assembly system includes: a database for storing information of an assembly and mounting area of a part combined to a mainboard, and program information such as information of a BIOS, a driving driver, and an operating system, and periodically updating the corresponding information through a communication part including a wired/wireless communication network; a device digestive module for checking the part through a photographing means, moving the checked part to the assembly and mounting area of the part provided on the mainboard through the photographing means and a robot arm for transfer, assembling, and mounting the part, and then writing a driving program and circuit information of the part; and an administrator terminal for periodically upgrading or updating part information necessary for the device digestive module by a part company server through a communication network including the wired/wireless communication network.

Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface 71, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surface 71 captured from above.

A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.

A method for manufacturing a pressure sensor includes: preparing a stem which has a cylindrical shape with a bottom as a diaphragm; mounting a sensor chip on the diaphragm; preparing a conductive member, in which an internal connection region is integrated with an external connection region electrically connected to an external circuit by an outer frame; forming a first resin mold to couple the internal connection region to the external connection region; separating the outer frame from the internal connection region and the external connection region; arranging the internal connection region in the stem; and electrically connecting the sensor chip and the internal connection region through the first connection member.

Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB.

An exemplary optical connector assembly may include a substrate of an optical printed circuit board (OPCB) with at least one optical device thereon, the substrate including one or more recesses, an optical connector with one or more alignment members for coupling an end of an optical waveguide to the optical device, and one or more inserts, each having an orifice for receiving one of the one or more alignment members and each arranged to be received in one of the one or more recesses. When assembled, the one or more inserts may be received in the one or more recesses and the one or more alignment members may be received in the orifices of the one or more inserts thereby coupling the optical waveguide to the substrate to form the exemplary optical connector assembly.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.