An apparatus includes an alignment module configured to align a first wafer and a second wafer based on alignment markers on the first wafer and corresponding alignment markers on the second wafer. The apparatus further includes a flag placement module configured to insert a plurality of flags between the first wafer and the second wafer, a flag-out mechanism configured to simultaneously move the plurality of flags to a flag-out position, and a controller configured to determine whether the wafers remain aligned within an alignment tolerance based on an amount of time for each flag of the plurality of flags to reach the flag-out position.

A method of assembling an antenna aperture from a plurality of antenna aperture segments is described. The method may include placing a first aperture segment relative to a second aperture segment to partially form the antenna aperture. Furthermore, an overlap of the first aperture segment overlaps a complementary underlap of the second aperture segment at a seam. The method may also include joining the overlap of the first aperture segment to the underlap of the second aperture segment to partially form the antenna aperture.

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

A device for automatically mounting a connector-housing with a contact-part attached to an electrical line includes a holder, a movable-gripper, an alignment-station, a camera, and a control-device. The holder fixes the connector-housing. The movable-gripper holds the contact-part and inserts the contact-part into a cavity of the connector-housing. The alignment-station includes an alignment-gripper that holds the contact-part and rotates the contact-part about a rotation-axis parallel to an insertion-direction. The camera determines an actual-rotational-position of the contact-part held by the alignment-gripper in relation to the rotation-axis. The control-device compares the actual-rotational-position with a predetermined-rotational-position based on the characteristics and arrangement of the connector-housing. The control-device further controls the alignment-gripper to perform a corrective rotational movement based on the result of the comparison.

Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.

Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

A method of assembling an antenna aperture from a plurality of antenna aperture segments is described. The method may include placing a first aperture segment relative to a second aperture segment to partially form the antenna aperture. Furthermore, an overlap of the first aperture segment overlaps a complementary underlap of the second aperture segment at a seam. The method may also include joining the overlap of the first aperture segment to the underlap of the second aperture segment to partially form the antenna aperture.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.