Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.

Wireless sensor patches include a skin-friendly adhesive and a flexible cover patch. In further examples, methods of manufacturing a plurality of wireless sensor patches include the step (I) of unwinding a flexible support membrane from a support membrane storage roll along an assembly path. The flexible support membrane is provided with a skin adhesive configured to mount a first face of the flexible support membrane to a skin surface. The method further comprises the step (II) of sequentially mounting a plurality of sensor devices with respect to a second face of the flexible support membrane along a longitudinal axis of the assembly path. The method further includes the step (III) of sequentially separating the flexible support membrane to provide the plurality of wireless sensor patches, wherein each wireless sensor patch includes a corresponding one of the plurality of sensor devices.

A printed circuit board is fabricated in a manufacturing process. In an inspection process, first and second light sources of an inspection device irradiate the printed circuit board with first and second light having first and second wavelength distributions. First and second imaging devices produce a monochromatic first image and a color second image of an inspection subject region of the printed circuit board based on the first and second light respectively reflected by the printed circuit board. Presence and absence of a defect is determined based on at least the first image by automatic optical inspection. Further, verification of the defect is performed by visual observation of at least the second image.

An organic light-emitting display apparatus includes a flexible substrate having a display region and a non-display region located at an outer region of the display region, the non-display region being folded with respect to the display region; at least one organic light-emitting diode (OLED) on the display region of the flexible substrate; and an encapsulation member encapsulating the display region.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.

There is provided a system 10 including at least one of inspection machines 20 and 22 and an NG board discharge machine 24 which moves an NG board to a checking position visible to a worker. The system 10 acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position. In this manner, it is not necessary to arrange the checking-purpose working machine adjacent of a downstream side of the inspection machines, and it is possible to arrange another working machine between the checking-purpose working machine and the inspection machine. In addition, even when the multiple inspection machines are arranged in the system, one checking-purpose working machine can correspond to the multiple inspection machines.

A substrate process system which includes a plurality of arranged process machines, and in which a circuit substrate is transported from an upstream process machine to a downstream process machine is provided. One process machine inspects small electronic components, and another process machine 90 inspects large electronic components. The small mounted components are inspected in detail. When the large mounted components are inspected, it is not necessary to inspect the large electronic components in detail to the degree that the small electronic components are inspected. It is possible to reliably inspect the small mounted components even though the inspection process requires a certain length of time, and it is possible to inspect the large components in less detail than the inspection process for the small components. Accordingly, it is possible to reliably perform an inspection process, and to decrease an inspection time at the same time.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.