Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.

A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

A method for automatically mounting a connector housing with a contact part attached to an electrical line includes holding the contact part, determining an actual rotational position of the contact part, comparing the actual rotational position with a predetermined rotational position, and performing a rotational position correction thereby aligning the connector part to the connector housing. The connector housing is fixed to a holder and the contact part is inserted into a cavity of the connector housing by means of a movable gripper.

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

An electronic component mounter is provided which easily detects penetrating portions. An electronic component mounter comprises a holding section configured to hold a board having a penetrating portion penetrating the board in a front-rear direction and into which a lead of an electronic component is inserted; a light section disposed on one face from among the front face and the rear face of the board when the board is held by the holding section and configured to irradiate a light beam, which is direct light or reflected light, on to the board; and a light receiving section disposed on the other face from among the front face and the rear face of the board when the board is held by the holding section and configured to receive the light beam via the penetrating portion.

A method for automatically mounting a connector housing with a contact part attached to an electrical line includes holding the contact part, determining an actual rotational position of the contact part, comparing the actual rotational position with a predetermined rotational position, and performing a rotational position correction thereby aligning the connector part to the connector housing. The connector housing is fixed to a holder and the contact part is inserted into a cavity of the connector housing by means of a movable gripper.

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300 C. or less to attach the die to the substrate. Devices produced using the methods are also described.