When a board to be produced is switched, it is possible to automatically discharge an unnecessary carrier tape 100 without detaching a feeder. For this, a control device 15 of a component mounting apparatus 10 includes: a component determination section S106 which determines a component not to be used in production of the next board when boards to be produced by the component mounting apparatus 10 are switched, and a discharge instruction section 110 which sends an instruction of discharging a carrier tape 100 which accommodates a component determined not to be used in the production of the next board by the component determination section S106 to a tape insertion port 21d.

A method for connecting direct light bars includes: providing connection wires, each of which has two ends to each of which a copper ring is mounted; providing light bars, each of which includes a wiring board having a first exposed copper zone that has a hole to serve as a circuit connection contact; providing a circuit board that has a second exposed copper zone including a hole to serve as a circuit connection contact; and positioning the two copper rings of each connection wire on the circuit connection contacts of the first and/or second exposed copper zones to be in alignment with the holes so as to allow the two copper rings to be connected to the holes corresponding thereto to establish circuit connection between the copper rings and the corresponding first and/or second exposed copper zones of the circuit board and the wiring boards of the light bars.

A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

A method for automatically mounting a connector-housing with a contact-part attached to an electrical line includes holding the contact-part, determining an actual-rotational-position of the contact-part, comparing the actual-rotational-position with a predetermined-rotational-position, and performing a rotational-position-correction thereby aligning the connector-part to the connector-housing. The connector-housing is fixed to a holder and the contact-part is inserted into a cavity of the connector-housing by means of a movable-gripper.

An electronic component mounting method for two types of boards, using an electronic component mounting system in which multiple mounters are arranged in series; the mounters include a board conveyance device having a first conveyance lane that loads the first board and a second conveyance lane that loads the second board, and a component transfer device having a first mounting head and a second mounting head; a portion of multiple mounters are set as independent production mounters and the remaining portion are set as second lane dedicated mounters; mounting a first set of electronic components on the first board is allocated to the first mounting heads of the independent production mounters; and mounting a second set of electronic components on the second board is allocated to the second mounting heads of the independent production mounters and to the first mounting heads and the second mounting heads of the second lane dedicated mounters.

Apparatus, systems, and methods for signal referencing for memory are described. In one embodiment, connector for a memory device comprises a housing having a first panel and a second panel opposite the first panel to be positioned adjacent a circuit board, the first panel and second panel defining a slot to receive a portion of the memory device, a first plurality of electrically conductive pins disposed in the slot and proximate the first panel to establish electrical connections with a plurality of electrical connectors on the memory device, wherein at least one of the first plurality of pins is a ground pin and a layer of conductive material disposed proximate the second surface. The ground pin is electrically coupled to the layer of conductive material. Other embodiments are also disclosed and claimed.

In a quartz crystal unit, the unit comprising a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, and first and second quartz crystal tuning fork tines, each of the first and second quartz crystal tuning fork tines having a first vibrational portion including a first width and a second vibrational portion including a second width greater than the first width, at least one groove being formed in at least one of opposite main surfaces of the first vibrational portion of each quartz crystal tuning fork tine, the first width of the first vibrational portion of each quartz crystal tuning fork tine being greater than 0.03 mm and less than 0.075 mm and the second width of the second vibrational portion of each quartz crystal tuning fork tine being greater than 0.04 mm and less than 0.23 mm.

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and at least one electronic component, which is integrated in the covering element and is electrically connected to the first printed circuit board.

The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.