Whether or not a lead wire has been normally cut and clinched can be reliably detected. A contact pipe is arranged in lead wire insertion holes of a pair of fixed pawls in a state of being electrically insulated from the fixed pawls. In a case where the lead wire is shorter than a set length after the lead wire is inserted into the lead wire insertion holes, a clearance of the pair of lead wire insertion holes is widened by a set amount in the event of outward bending of the lead wire and is narrowed by a set amount in the event of inward bending. A cut-and-clinch operation is performed with S4 bypassed in a case where the length of the lead wire is at least the set length.

A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.

The present invention relates construction element comprising: a sandwich structure comprising an electrically insulating layer and an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by the electrically insulating layer. A circuit board is carrying an electronic component and is positioned between the electronic component and the electrically conducting rear layer. The electronic component comprising a first and a second electrical terminal, wherein the first electrical terminal is in electrical connection with the electrically conducting front layer, and the second electrical terminal is in electrical connection with the electrically conducting rear layer.

A method of joining a first tin-plated electrical component to a second tin-plated electrical component, and components joined to exhibit reduced stress levels at the joined location. The method includes defining a pocket in the second component that is shaped to accept a portion of the first component, placing the portion of the first component substantially within the pocket to define an interfacial region, and using a resistance welder to both form a solid-state diffusion bond along at least a portion of the interfacial region and fill a substantial remainder of the interfacial region with melted tin plating from one or both of the first and second components.

Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.

An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.

There is provided a component mounting method for fitting a component including downwardly-extending insertion pins on a substrate by sucking the component by a suction nozzle and moving the suction nozzle such that the insertion pins of the sucked component are inserted into pin insertion holes formed in a substrate. The component mounting method includes: positioning the insertion pins and the pin insertion holes, and then pushing the component against the substrate by the suction nozzle, thereby fitting the component on the substrate such that the insertion pins are inserted into the pin insertion holes; and pushing again the component against the substrate after the component is fitted on the substrate, so as to push the insertion pins into the pin insertion holes.

An embedded multi-terminal capacitor embedded in a substrate cavity includes at least one metal layer patterned into a plurality of power rails and a plurality of ground rails. The substrate includes an external power network.