An automated assembly sensor cable has a generally wide and flat elongated body and a registration feature generally traversing the length of the body so as to identify the relative locations of conductors within the body. This cable configuration facilitates the automated attachment of the cable to an optical sensor circuit and corresponding connector. In various embodiments, the automated assembly sensor cable has a conductor set of insulated wires, a conductive inner jacket generally surrounding the conductor set, an outer jacket generally surrounding the inner jacket and a registration feature disposed along the surface of the outer jacket and a conductive drain line is embedded within the inner jacket. A strength member may be embedded within the inner jacket.

A liquid discharge apparatus includes: a pressure chamber; a film covering the pressure chamber; a piezoelectric element disposed on the film and including a piezoelectric part, a first electrode, and a second electrode, wherein the first electrode is disposed on a first side of the piezoelectric part facing the pressure chamber, and the second electrode is disposed on a second side of the piezoelectric part opposite the first side; a gold trace connected to the first electrode or the second electrode; and a first metal part made of a metal material except for gold and positioned between the film and the gold trace. The first metal part is laminated with the gold trace.

An intrinsic safe in-line adaptor with an integrated capacitive barrier for connecting a wireless module with an antenna. The in-line adaptor (e.g., N-type to N-type) can be designed to include an intrinsic safe circuit and the integrated capacitive barrier. The intrinsic safe circuit further includes a multi-layer PCB and the PCB can be potted and sealed with a mechanical metal casing. The intrinsic safe capacitive barrier can be integrated with a coaxial connector and mounted as part of a flameproof enclosure to meet an explosion safety standard and an intrinsic safety requirement. The mechanical metal casing can be isolated by the enclosure (e.g., rubber) to meet isolation requirements. The wireless module can be directly connected with the antenna utilizing the in-line adaptor via the coaxial connector and without any specific cable assembly.

The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

A liquid discharge apparatus includes: a pressure chamber; a film covering the pressure chamber; a piezoelectric element disposed on the film and including a piezoelectric part, a first electrode, and a second electrode, wherein the first electrode is disposed on a first side of the piezoelectric part facing the pressure chamber, and the second electrode is disposed on a second side of the piezoelectric part opposite the first side; a gold trace connected to the first electrode or the second electrode; and a first metal part made of a metal material except for gold and positioned between the film and the gold trace. The first metal part is laminated with the gold trace.

An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.

A bipolar ionization device in which fiberglass is used as the dielectric. In one embodiment, a fiberglass board is used, with the anode on one side of the board and the cathode on the other side of the board. A number of flat boards can be stacked, with spacing between them to allow air flow to scavenge ions, with stanchions providing both mounting and electrical connections to the ionization devices. In another embodiment, a fiberglass tube is used, with the cathode inside the tube and the anode outside the tube.

A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case. The wiring structure may include a material capable of being bent or folded, and also may include a connection wiring disposed on an inner surface of the upper flexible case for electrically connecting the flexible integrated circuit device package with an external device, a connection pin disposed on an outer surface of the upper flexible case, and a via wiring passing through the upper flexible case. The anisotropic conductive film may be disposed between the flexible integrated circuit device package and the upper flexible case for electrically connecting the connection pad with the connection wiring.