An interface structure enables a high reliable electrical connection between a socket and a circuit board. An adaptor for the socket includes a plate 210 and a base 220. A plurality of through holes 212 are formed in the plate 210 and a plurality of through holes 222 that align with the plurality of through hole 212 are formed in the base 220. A metal plating is applied to the inner wall of the through hole 222 and a coil spring 230 is received in the through hole 222. One end of the coil spring 230 is connected to a terminal of a socket 100 inserted from the through hole 212 and the other end as a movable contact portion 236 is connected to an electrode of the circuit board 300.

Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

An electronics package for an alternator includes an electrically conductive carrier member and a terminal assembly engaging the carrier member. The carrier member includes an inner side, an outer side, and at least one passage extending from the inner side to the outer side. A plurality of switches are connected to the carrier member. The terminal assembly includes an electrically insulative portion and a plurality of electrical traces extending through the electrically insulative portion. The electrically insulative portion includes a post extending through the at least one passage of the carrier member, a first shoulder engaging the outer side of the carrier member, and a second shoulder engaging the inner side of the carrier member. The post, the first shoulder, and second shoulder are all formed as a unitary component.

A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.