The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

A sensor system can be configured to perform dielectric spectroscopy (DS). For example, the system can include a sensor configured to measure dielectric permittivity of a fluid in response to an RF input signal. Associated interface electronics can include a transmitter to drive the sensor with the RF input signal and a receiver to receive and process an RF output signal from the sensor in response to the RF input signal.

An apparatus is disclosed herein comprising one or more optically reflective materials, one or more electrodes, one or more photodetecting materials, and one or more substrates. At least one optically reflective material is electrically insulating, and the electrodes are positioned adjacent to the insulating optically reflective material. Additionally, the photodetecting materials are positioned on the substrates and are adjacent to the one or more electrodes. A method is disclosed comprising providing one or more photodetecting materials positioned on one or more substrates, placing one or more electrodes adjacent to the photodetecting materials, and placing one or more optically reflective materials adjacent to the electrodes and/or substrate. At least one optically reflective material is electrically insulating, and the insulating optically reflective material is placed adjacent to the electrodes. A method is also disclosed comprising providing an apparatus as above and using the apparatus.

This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module.

A process for manufacturing an electrical lead having one or more electrodes includes providing an elongate member having at least one polymeric region and further having at least one electrical conductor that extends along at least a part of a length of the elongate member and that is contained in a wall of the elongate member. A length of the at least one electrical conductor is accessed at the at least one polymeric region. An electrically conductive adhesive is applied to the length of the at least one electrical conductor that has been accessed.

A touch module and a manufacturing method thereof, and a touch screen are provided. The method of manufacturing a touch module includes: forming a composite electrode, a lead, and a lead pad each of which has a stacked structure of a transparent conductive layer and a metal layer on a substrate by one patterning process, the touch module including a touch area, and a peripheral area and a bonding area located at the periphery of the touch area, the composite electrode being formed in the touch area, the lead being formed in the peripheral area, and the lead pad being formed in the bonding area; forming a protective layer outside the touch area, and etching away the metal layer of the composite electrode to form a transparent touch electrode.

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.