The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods.

The present invention provides an automatic encoding device including a first electrode, a second electrode, and a third electrode. The first electrode and the second electrode are connected through a connecting point, so that an electric parameter between the first electrode and the second electrode changes according to a parameter needing to be corrected. The present invention further provides a method for applying the automatic encoding device to various biosensors and a method for manufacturing the automatic encoding device. Positions and the number of contacts for connecting the automatic encoding device and a detection system are fixed. Therefore, connection sites on the detection system are effectively utilized. On the other hand, the automatic encoding device in the present invention can provide different parameter information by only changing the positions of the connecting points on the electrodes, the process is simple and stable, and the probability of human errors is reduced.

A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.

A method of manufacturing an upper electrode of a plasma processing device includes forming a covering layer having plasma resistance on a surface of a main body portion constituting the upper electrode at a side of the processing space; polishing a surface of the covering layer exposed to the processing space; and after the polishing, blasting the surface of the covering layer polished at the polishing.

Sensor systems are described that are designed to be integrated with gloves for the human hand. An array of sensors detects forces associated with action of a hand in the glove, and associated circuitry generates corresponding control information that may be used to control a wide variety of processes and devices.

A sensor system can be configured to perform dielectric spectroscopy (DS). For example, the system can include a sensor configured to measure dielectric permittivity of a fluid in response to an RF input signal. Associated interface electronics can include a transmitter to drive the sensor with the RF input signal and a receiver to receive and process an RF output signal from the sensor in response to the RF input signal.

A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.

The invention relates to a grounding device (10) for a battery (100) of a vehicle, comprising a connection section (20) for connecting electric wiring (110) to the battery (100), a grounding section (30) for connecting to a ground (120) of the vehicle, and a contact section (40) for connecting to an external power source, characterized in that the contact section (40) is embodied at least sectionally by way of folding over the material of the grounding device (10).

Methods for the production of a circuit board involving the removal of a subregion in accordance with various embodiments of the invention are disclosed. In one embodiment, the production of a circuit board, made of at least two interconnected layers of material, involving the removal of a subregion including a portion of at least one of the at least two interconnected layers from the circuit board includes providing an adhesion preventing material under the subregion to be removed to a layer in the at least two interconnected layers that is adjacent to the at least one layer including the subregion, separating edge regions of the subregion to be removed from adjoining regions of the circuit board, connecting an external surface of the subregion to be removed to an external element, and displacing the external element to separate the subregion to be removed from the adjacent layer of the circuit board.