A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.

The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.

A method of making a folded micro-wire substrate structure includes providing a transparent flexible substrate having a first side and a second side opposed to the first side. The flexible substrate has a first portion and a second portion adjacent to the first portion of the flexible substrate. One or more electrical conductors and one or more electrical components are formed on or in the flexible substrate. At least one optical element is formed on or in the flexible substrate in the second portion. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is aligned with the second portion in a perpendicular direction and the optical element directs light to or from the electrical component.

A method of making a folded micro-wire substrate structure includes providing a flexible substrate and first, second, and third portions. One or more electrical conductors are formed on or in the flexible substrate. The flexible substrate is folded with a first fold between the first and second portions so that the first portion is located adjacent to the second portion in a perpendicular direction. The flexible substrate is folded with at least a second fold between the second and third portions so that the second side is between the second portion and the third portion in the perpendicular direction. The folded flexible substrate is secured to form the folded micro-wire substrate structure.

A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

An integrated circuit includes a magnetic field sensor and an injection molded magnetic material enclosing at least a portion of the magnetic field sensor.

An assembly for a medical lead includes an elongated lead body, and a conductive element located at a distal portion of the lead body. The conductive element substantial!) encircles a longitudinal axis of the lead body. The assembly further includes a plurality of insulated conductors extending within the lead body, each of the insulated conductors being in electrical contact with the conductive element and extending to a proximal end of the lead body. Each of the insulated conductors contacts a different circumferential portion of the conductive element. The conductive element is configured to facilitate mechanical and electrical separation of different circumferential portions of the conductive element to form two or more electrode segments for the medical lead from the conductive element.

A plug apparatus for sealing an interior of a duct for use in a process for forming an insulated register box has a frame, a shaft extending outwardly of the of the frame, and a plurality of layers of flexible material radiating outwardly of the shaft adjacent to an end of the shaft opposite the frame. The plurality of layers of flexible material are adapted to have an outer periphery bearing against an interior surface of the duct. Each layer of flexible material has an outer diameter greater than an inner diameter of the duct. The flexible material is formed of a neoprene material. The frame is affixed to a support surface having an opening therein. The opening is adapted to receive an outer diameter of the duct therein.