Patent classifications
Y10T29/49172
ELECTROPHYSIOLOGY CATHETER DESIGN
The present invention relates to a method, device, and system for improved mapping and/or ablation of a tissue. The device may generally include an elongate body and a distal assembly affixed to the elongate body that includes a treatment electrode having a conductive mapping region and a selectively conductive ablation region that is conductive of high-frequency current and substantially non-conductive of low-frequency current. Alternatively, the device may generally include a treatment electrode having a conductive mapping or ablation region and a region that is coated with an electrically insulated but thermally conductive layer.
WIRE OVERMOLD DEVICE AND METHOD OF FORMING WIRE OVERMOLD DEVICE
A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.
Electrophysiology catheter design
The present invention relates to a method, device, and system for improved mapping and/or ablation of a tissue. The device may generally include an elongate body and a distal assembly affixed to the elongate body that includes a treatment electrode having a conductive mapping region and a selectively conductive ablation region that is conductive of high-frequency current and substantially non-conductive of low-frequency current. Alternatively, the device may generally include a treatment electrode having a conductive mapping or ablation region and a region that is coated with an electrically insulated but thermally conductive layer.
Wire overmold device and method of forming wire overmold device
A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.
End termination for three-phase insulated conductors
A fitting for coupling ends of cores of three insulated conductors includes an end termination placed over end portions of the three insulated conductors. The end termination includes three separate openings that pass through the end termination longitudinally. Each of the insulated conductors passes through one of the openings with end portions of the insulated conductors protruding from one side of the end termination. Exposed cores of the end portions of the insulated conductors protrude from the end termination. A cylinder is coupled to the side of the end termination from which the end portions of the insulated conductors protrude. An electrical bus is coupled to the exposed portion of the cores. Electrically insulating material fills the cylinder such that the cores are substantially enclosed in the electrically insulating material. An end cap is coupled to the cylinder to seal off the interior of the cylinder.
Methods for integrated circuit fabrication with protective coating for planarization
Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.
Systems and methods for making and using tip electrodes for leads of electrical stimulation systems
An implantable electrical stimulation lead includes a lead body, electrodes disposed along a distal end of the lead body, terminals disposed along the proximal end of the lead body, and conductors coupling the terminals to the electrodes. The electrodes include a tip electrode having an electrode body with an outer stimulating surface. An internal lumen is defined in the electrode body and extends inwardly from an opening in a proximal end of the electrode body. Side apertures are formed between the outer stimulating surface and the internal lumen. A portion of the lead body is disposed within the internal lumen and side apertures through the opening in the proximal end of the electrode body. That portion of the lead body facilitates retention of the tip electrode on a distal tip of the lead body.