The present invention relates to an identification holding apparatus, an optical fiber splicing and distribution module, an optical fiber management apparatus, and a method for assembling an optical fiber management apparatus. The optical fiber management apparatus includes the identification chip holding apparatus and the optical fiber splicing and distribution module, where a snap-on structure of the identification chip holding apparatus is fitted into an optical fiber connector, and a chip accommodating structure of the identification chip holding apparatus is installed in a hollow groove; and a chip in the chip accommodating structure implements external communication by using the chip accommodating structure and a printed circuit board. The optical fiber management apparatus in the embodiments of the present invention has good compatibility with a low cost and allows a convenient and quick operation of upgrading a common network to an intelligent network without interrupting a fiber-optic communication service.

A transducer includes an element disposed on a substrate, where the element includes an electrode, and a connection electrode electrically connected to the electrode of the element. A conductive portion disposed on an insulating film of a flexible print circuit board is electrically connected to the connection electrode. Part of the conductive portion is exposed so as to face a surface of the substrate having the element disposed thereon. An insulation layer is disposed on part of the surface of the substrate facing the flexible print circuit board.

Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

A holding frame for a plug-type connector is intended to have good heat resistance and a high level of mechanical robustness and, when installed in a metallic plug-type connector housing, enable protective grounding while at the same time being convenient to use, in particular during the replacement of individual modules. To this end, it is proposed to manufacture the holding frame at least partially from spring-elastic sheet metal. For this purpose, the holding frame can have a basic portion and a deformation portion, which are formed from different materials. The basic portion is used for fixing an accommodated module in a plane. The deformation portion can assume an insertion state and a holding state, wherein the insertion state permits insertion of at least one module into the holding frame in a direction transverse to the plane and an accommodated module is fixed in the holding state.