A cochlear implant including a cochlear lead, an antenna, a stimulation processor, and a magnet apparatus, associated with the antenna, including a case defining a central axis, a magnet frame within the case and rotatable about the central axis of the case, and a plurality of elongate diametrically magnetized magnets that are located in the magnet frame, the magnets defining a longitudinal axis and a N-S direction and being freely rotatable about the longitudinal axis relative to the magnet frame.

Various embodiments of an implantable medical device and a system that includes such device are disclosed. The device includes a housing that includes a polymeric material, a sealed container disposed within the housing, and an electronic assembly disposed within the container. The device also includes a battery disposed within the container and electrically connected to the electronic assembly.

In some examples a medical device includes circuitry configured to at least one of sense a physiological parameter of a patient or deliver a therapy to the patient. The medical device may also include a housing configured to house the circuitry, wherein the housing includes a plurality of structural members and an attachment mechanism that joins the plurality of structural members. The attachment mechanism may be configured to suppress induced currents in the housing when the medical device is exposed to a time-varying magnetic field.

A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.

Implantable devices require protection to protect a human or animal body from implant contamination and to protect implant electrical connections and electronics from corrosion. Although PDMS can be substantially biocompatible, it still has a relatively high permeability to moisture which can lead to degradation of the implant electronics.

An implantable electric device is provided comprising: a flexible substrate having one or more electrical conductors and a first surface comprising a Liquid-Crystal Polymer (LCP); a first biocompatible encapsulation layer; a first adhesion layer disposed between the first surface and the first encapsulation layer; wherein: the first adhesion layer comprises a ceramic material; the first encapsulation layer comprises a silicone rubber such as a PDMS, and the first adhesion layer and the first encapsulation layer are configured and arranged to conform to the first surface and to resist the ingress of fluids into at least a portion of the first surface.

By providing a bilayer having an encapsulant comprising a silicone rubber and a conformal adhesion layer comprising ceramic materials, the adhesion layer appears to show significantly higher stability in ionic media, thereby providing relatively longer protection in case of any delamination or water permeation through the encapsulant.

A peripheral nerve stimulator configured as a flexible circuit to stimulate or block the operation of a nerve or nerve bundle, including electrode array, cable and bond pad portions connected to an electronics package. The electrode array is configured for peripheral nerve modulation and may be curved cylindrically to encompass a nerve. A cylindrical curve can be imparted through thermoforming or by applying a stretchable polymer. The stretchable polymer places the electrode array portion into a cylinder when the electrode array portion is in a relaxed position. The electronics package includes low profile, stacked thin chip electronic components that are tunable in-situ, requiring less vertical and lateral space than stacked passives. The thin chip components may be high density trench capacitors, metal-on-semiconductor capacitors positioned on an integrated circuit chip. The thin chip components may include metal-insulator-metal capacitors having a tunable capacitance value and/or may be a binary capacitor array.

A method for subcutaneously treating pain in a patient includes first providing a neurostimulator with an IPG body and at least a primary, a secondary, and a tertiary integral lead with electrodes disposed thereon. A primary incision is opened to expose the subcutaneous region below the dermis in a selected portion of the body. A pocket is then opened for the IPG through the primary incision and the integral leads are inserted through the primary incision and routed subcutaneously to desired nerve regions along desired paths. The IPG is disposed in the pocket through the primary incision. The primary incision is then closed and the IPG and the electrodes activated to provide localized stimulation to the desired nerve regions and at least three of the nerves associated therewith to achieve a desired pain reduction response from the patient.

The disclosure relates to an implant comprising an electrode connection device and a housing, wherein a cover for closing the housing is formed on the electrode connection device. A method for producing an implant is also disclosed.

Provided are methods of making a liquid and liquid vapor-proof material, and relates long-term implantable electronic devices. The method comprisies providing a first substrate having a first-side encapsulating layer supported by at least a portion of the first substrate; providing a material onto the first-side encapsulating layer; providing a second substrate having a second-side encapsulating layer supported by at least a portion of the second substrate; covering an exposed surface of the material provided onto the first-side encapsulation layer with the second-side encapsulating layer; wherein said encapsulating layers are substantially defect free so that liquid or liquid vapor is prevented from passing through each of the encapsulating layers; thereby making the liquid or liquid vapor-proof material.

An implantable medical device having a package, including: a device body, and a package configured for packaging the device body. The package includes at least one organic film layer and at least one inorganic film layer that are stacked on one another. An innermost layer of the package is an organic film layer or an inorganic film layer, and an outermost layer of the package is an organic film layer or an inorganic film layer. Each organic film layer is a parylene film or polyimide resin film with biocompatibility, and each inorganic film layer is an inorganic film with biocompatibility. A method for packaging an implantable medical device is also provided.