A61N1/3758

Biostimulator having flexible circuit assembly

A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.

System for transmitting electrical current to a bodily tissue

In some embodiments, an apparatus includes a substantially rigid base and a flexible substrate. The substantially rigid base has a first protrusion and a second protrusion, and is configured to be coupled to an electronic device. The flexible substrate has a first surface and a second surface, and includes an electrical circuit configured to electronically couple the electronic device to at least one of an electrode a battery, or an antenna. The flexible substrate is coupled to the base such that a first portion of the second surface is in contact with the first protrusion. A second portion of the second surface is non-parallel to the first portion.

RF filter for an active medical device (AMD) for handling high RF power induced in an associated implanted lead from an external RF field

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Implantable devices with welded multi-contact electrodes and continuous conductive elements

An implantable device has a hermetically sealed enclosure, an electronic device within the hermetically sealed enclosure, and a plurality of feedthrough conductors in mechanical contact with the hermetically sealed enclosure and exposed outside of the hermetically sealed enclosure. The implantable device also has a flexible substrate with a plurality of therapy contacts, and a plurality of continuously conductive elements extending along the flexible substrate from the array of therapy contacts and terminating at a plurality of connection pads. Each of the continuously conductive element is integral with at least one therapy contact and at least one connection pad to electrically communicate the noted therapy contact(s) and the noted connection pad(s). The thickness of each continuously conductive element may be between about 5 and 190 microns. The implantable device also has a plurality of mechanical welded couplings that each couple at least one of the connection pads.

Method For Implanting A Medical Device In The Body Tissue Of A Human Or Animal Patient

A device that is implantable in body tissue of a human or animal. The device is comprised of a header comprising at least one terminal adapted for removable connection to a lead and an open ended case closed by a plate to form a housing. The housing is comprised of a surrounding edge wall joined to a first side wall and a second side wall opposed to the first side wall. At least a first suture port extends through the edge wall and the second side wall but not the first side wall at an upper edge region of the housing. A second suture port may extend through the surrounding edge wall and the second side wall but not the first side wall in a similar manner. A third suture port may extend through the header. The three suture ports may define a triangular attachment configuration.

IMPLANTABLE STIMULATOR WITH AN ELECTRODE ARRAY, CONFORMABLE SUBSTRATE, AND MECHANICAL STRAIN RELIEF

An implantable stimulator is provided having a substrate comprising a conformable portion with an electrode array, and a pulse generator. A plurality of electrical interconnections are positioned between the surfaces of the substrate. The conformable portion has a thickness equal to or less than 0.5 millimeters. Optionally, one or more encapsulation layers may be provided. Optionally, one or adhesion layers may also be provided comprising a ceramic material.

By providing a more easily patternable substrate, more complicated electrode array configurations may be supported, allowing a higher degree of flexibility to address transverse and/or longitudinal misalignment. By providing a relatively thin implantable electrode array, user comfort may be increased. The one or more adhesion layers improve the performance of the encapsulation.

Implantable nerve transducer
11364385 · 2022-06-21 · ·

Implantable nerve transducers are provided herein, along with methods of fabricated such implantable nerve transducers. An exemplary implantable nerve transducer includes a plurality of semiconductor structures protruding from an exterior surface provided by a substrate and a plurality of conductors extending from the exterior surface of the substrate to an interior surface of the substrate and within a plurality of openings in the substrate. Each conductor is electrically coupled to one of the semiconductor structures. The exemplary implantable nerve transducer further includes one or more electronic components electrically coupled to the semiconductor structures by the conductors and a cap bonded to the substrate to provide a sealed chamber. The sealed chamber contains the one or more electronic components.

MACHINED FEATURES OF ENCLOSURES FOR IMPLANTABLE MEDICAL DEVICES
20220176131 · 2022-06-09 ·

Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.

Apparatus, system, and method for selective stimulation

An implantable neurostimulator system is disclosed, the neurostimulator system comprising a hollow cylindrical electronics enclosure having a top, a bottom, and a side; a coil extending from a first part of the electronics enclosure; and at least one electrode operatively connected to the electronics enclosure.

IMD having a core circuitry support structure

A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure.