A biostimulator, such as a leadless pacemaker, including a header assembly having an electrical feedthrough assembly incorporating a helix mount, is described. The header assembly includes a fixation element mounted on the helix mount. The helix mount is mounted on a flange of the electrical feedthrough assembly, and thus, the fixation element can attach the leadless biostimulator to a target tissue. An electrode of the electrical feedthrough assembly is mounted within the flange to deliver a pacing impulse to the target tissue. A ceramic portion of the helix mount is disposed between the flange and the electrode to block an electrical path between the electrode and the flange. Accordingly, the helix mount both retains the fixation element on the leadless biostimulator and electrically isolates the flange and electrode components of the electrical feedthrough. Other embodiments are also described and claimed.

A battery configured to support a relatively high rate of energy discharge relative to its capacity for energy intensive therapy delivery. The battery includes a feedthrough insulator cap disposed within the interior of the battery on at least a portion of a ferrule, at least a portion of an insulator, and at least a portion of a pin, which define a feedthrough extending through an enclosure of the battery; a first electrode disposed within the enclosure and electrically coupled to the pin; a second electrode disposed within the enclosure and separated a distance from the first electrode; and an electrolyte disposed between the first electrode and the second electrode. During operation of the battery, the feedthrough insulator cap reduces dendrite formation on at least a portion of the ferrule, the pin, or both.

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

A biostimulator and a pace mapping system for deep septal pacing. The biostimulator includes a pacing element that extends distally beyond a fixation element. The pacing element is insulated between a distal tip of the fixation element and a distal portion of the pacing element. The pace mapping system can be used to determine a distance between a septal wall of a heart septum and a bundle branch within the septum. The pacing element can be selected based on the distance, and delivered into the septum to pace the bundle branch. Other embodiments are also described and claimed.

Various embodiments of an implantable medical device and a system that includes such device are disclosed. The device includes a housing including a polymeric material, and an electronics module disposed within the housing and having a substrate, a power source disposed on the substrate, and circuitry disposed on the substrate and electrically connected to the power source. The device also includes a conformal coating disposed over at least a portion of the electronics module.

A medical device includes a case and a core assembly. The core assembly includes operational circuitry enclosed within a core assembly housing. The medical device also includes a battery assembly, which includes a battery enclosed within a battery housing. The case includes the core assembly housing and the battery housing. A first electrode is coupled to, and electrically isolated from, the case; and a second electrode is electrically coupled to the case. The second electrode is electrically coupled to the operational circuitry via a sensing pathway that includes a portion of the case. The battery is electrically coupled to the operational circuitry via an energy supply pathway that includes the portion of the case.

Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises: a housing including a plurality of feedthroughs extending through the housing, a first electrode, a second electrode, and a biocompatible circuit board disposed around an outer surface of the housing. The biocompatible circuit board comprising a plurality of traces, wherein a first trace of the plurality of traces is coupled to the first electrode and a first feedthrough of the plurality of feedthroughs, and a second trace of the plurality of traces is coupled to the first electrode and a second feedthrough of the plurality of feedthroughs.

A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.

A method for producing a feedthrough component of a medical electronic device, in particular an implantable device, wherein a feedthrough main body, in particular made of ceramic, is produced and is provided over a large area with a metal coating, and the metal coating is then structured, wherein the structuring is performed by at least partially removing the metal coating in layers in a number of sub-steps by means of a processing laser.

The disclosure relates to an implant comprising an electronics module and an energy store, wherein the volume of the electronics module is less than 25% of the volume of the energy store.