The present disclosure provides a method for removing silicon powder in a coolant for monocrystalline silicon slicing with a diamond wire, including following steps: preparing an inorganic coagulation-inducing saline solution; mixing the inorganic coagulation-inducing saline solution with a waste coolant of the coolant after monocrystalline silicon slicing to obtain a mixture, and leaving the mixture to stand to carry out agglomeration and precipitation of the silicon powder. The inorganic coagulation-inducing saline solution has advantages of being inexpensive, non-toxic, easy to obtain, and achieving good agglomeration and precipitation. It is inexpensive to remove the silicon powder in the waste coolant for the monocrystalline silicon slicing with the diamond wire, and does not cause environmental pollution. The recovered silicon powder can be recycled and sold again, and the coolant can be reused for cutting after simple treatment.

A chip discharge device of a machine tool includes a coolant tank storing coolant which is supplied to and dropped from a machining point, and a chip conveyor discharging chips which are generated at and dropped from the machining point, to an outside of the machine tool. A bottom wall of the coolant tank is inclined in a chip discharge side by mounting the coolant tank to the bed.

Degassers, degassing systems, and methods of using degassers to remove gas molecules entrapped or dissolved in a processing liquid. The degasser has a vacuum chamber with one or more walls; one or multiple inlets and one or multiple outlets through which the liquid is respectively passed into and out of the vacuum chamber, the inlet(s) and the outlet(s) penetrating the one or more walls; one or multiple separators located inside the vacuum chamber and being pervious to the gas molecules but impervious to the liquid; at least one vacuum for applying through a vacuum port a pressure differential across the separator(s) to cause the gas molecules to leave the liquid and to permeate through the separator(s) thereby removing the entrapped or dissolved gas from the liquid; and optionally one or multiple feed lines in fluid communication with the inlet(s) and two or more than two separators.

Fibrous filtration media and methods of making and using the same are provided whereby the media includes a wet-laid nonwoven fibrous web having from about 20 wt. % to about 80 wt. %, based on total weight of fibrous web, of bicomponent staple O1 fibers, and from about 10 wt. % to about 50 wt. %, based on total weight of the fibrous web, of fibrillated lyocell staple fibers. The

fibrous web exhibits a wet burst strength of greater than 3 bar, for example between about 3 bar to about 6 bar and is especially suitable eqi for use in filtering process fluids (e.g., water) associated with wire electron discharge machining (WEDM).

The present disclosure is directed to fluid filtering systems and methods for use during semiconductor processing. One or more embodiments are directed to fluid filtering systems and methods for filtering ions and particles from a fluid as the fluid is being provided to a semiconductor wafer processing tool, such as to a semiconductor wafer cleaning tool.

The separation apparatus for separation of material from a liquid includes a tank (10) through which the liquid can be passed and a conveying device (20). The tank has a bottom (10c) on which material collects during operation. The conveying device has a conveying element (21) that can be moved along the bottom (10c) by a drive (25). The conveying element is set up for picking up material that has collected on the bottom and for conveying it out of the tank (10).

The present disclosure is directed to fluid filtering systems and methods for use during semiconductor processing. One or more embodiments are directed to fluid filtering systems and methods for filtering ions and particles from a fluid as the fluid is being provided to a semiconductor wafer processing tool, such as to a semiconductor wafer cleaning tool.

An air filtration assembly for filtering airborne pollutants associated with soldering may include a housing which may include an intake and an exhaust, a filter which may be disposed in the housing between the intake and the exhaust, a blower which may draw an airflow into the air filtration assembly through the intake, the filter and out the exhaust, and a heat resistant pad which may be removably operably coupled to an exterior of the housing. A top surface of the heat resistant pad may be disposed substantially parallel to a work surface on which the air filtration assembly may be disposed.

The improvement of prior art air cleaning devices and processes is provided by the present disclosures in the form of a single, compact point of use scrubber to be used for extracting particles and harmful gases from a discharged air streams from processes required in electronic chip manufacturing. The device and processes described in the present invention are a compact series of apparatus improved for more effective capture of particulates, harmful gases and excess humidity required to be eliminated prior to emission into ambient air. The device uses less water, reduced sized water droplets and natural polarity of particles and droplets as a self cleaning capture mechanism for cleaner and less humid discharge into ambient air without the use of filters, ESP or WESP devices. Periodical shutdown of production lines and maintenance costs are significantly reduced or eliminated as the device cleans itself by continuous operation. Improvements in impaction and multiplicity of low pressure zones are provided by the device of various but not limited to the provided selection options of impeller liners used in the process disclosures.

A method for making a filter membrane includes: forming a polymer layer; applying a plurality of nanoparticles on the polymer layer, the nanoparticles being self-assembled to form a closed pack arrangement on the polymer layer; heating the nanoparticles such that a portion of the polymer layer contacting the nanoparticles is softened so that the nanoparticles are sunk into the polymer layer; and removing the nanoparticles from the polymer layer so that the polymer layer is formed with a plurality of pores penetrating the polymer layer and being arranged in a honeycomb pattern.