A wipe dispenser for use in metering out consistent doses of a composition onto a disposable wipe includes a mixing and dispensing assembly. The assembly has a vessel holding a first liquid for the composition and a first pump to convey the first liquid. A bottle having a second pump to convey a second liquid of the composition is stored within the bottle. A funnel arrangement is in downstream communication with the first pump and second pump. The funnel arrangement includes a mixing chamber for mixing the first and second liquids and a dispensing funnel in communication with and downstream of the mixing chamber. A wipe can be pulled through the dispensing funnel and wetted with a mixture of the first liquid and second liquid from the mixing chamber. A push bar attached to the funnel arrangement can selectively apply the force to actuate the first pump and second pump.

A method, apparatus, and system for obtaining a solution from a solid product are disclosed. A solid product is housed in a dispenser. A liquid is introduced into the housing of the dispenser to interact with the solid product to form a solution. To control the concentration of the formed solution, the turbulence of the liquid introduced to the dispenser is controlled and adjusted either manually or on a real time basis to account for varying characteristics of either or both of the solid product and the liquid. The dispenser will adjust the turbulence based on the characteristics to maintain a formed solution within an acceptable range of concentration. The concentrated solution can then be discharged from the dispenser to an end use application.

A method of producing washing hydrogen water in an embodiment, includes: a step of storing ammonia water in a first tank; a step of transferring the ammonia water from the first tank to a second tank; a step of diluting the transferred ammonia water with ultrapure water in the second tank; a step of mixing the diluted ammonia water into hydrogen water; and a washing step of washing an inside of the first tank by ultrapure water to remove fine particles derived from ammonia generated in the first tank.

A method of reducing cross-contamination on a wafer, the method including removing the wafer from an electroplating solution, rinsing the wafer with an acid, wherein the acid contacts residual electroplating solution on the wafer and forms a rinsate, and removing the rinsate from the wafer. Further, a method of removing cross-contamination on a wafer, the method including rinsing the wafer with a methane sulfonic acid (MSA) mixture, where the MSA mixture contacts residual electroplating solution on the wafer and forms a rinsate and removing the rinsate from the wafer.

An aeration plate is provided, including an aeration top plate portion and a side baffle portion. The aeration top plate portion is scattered with a plurality of aeration holes, such that the aeration top plate portion and the side baffle portion cooperate to form an aeration member. A fruit and vegetable cleaning machine is provided, including a machine body. The machine body is provided with a cleaning tank with a top opening, and the cleaning tank is provided with the aeration plate at an inner bottom wall, such that an area enclosed by the aeration top plate portion, the side baffle portion, and the inner bottom wall forms a first dissolving zone for gas and water, and a second dissolving zone for bubbles and water is formed between a periphery of the aeration plate and the cleaning tank.

Embodiments of the present disclosure provide a detergent dispenser device and methods of systems related thereto. Dispensers of the present disclosure comprise a container with side walls, a base, and a lid. The dispensers and methods of use described herein are operable to store and contain a cleaning agent, allow fluid to be applied to the agent to create a cleaning solution, and further facilitate drying and fluid management.

A substrate cleaning method, including a step of transporting a substrate after the substrate has been polished; a step of holding the substrate substantially horizontally by a substrate holding portion; a step of scrub cleaning a lower surface of the substrate while rotating the substrate; a first step of, after the step of scrub cleaning is performed, supplying a chemical solution from a first nozzle to the lower surface of the substrate while rotating the substrate; and a second step of, after the first step is performed, supplying a bubble-containing pure water from a second nozzle to the lower surface of the substrate while rotating the substrate, wherein bubbles contained in the bubble-containing pure water have bubble diameters of 1 m or more and 500 m or less.

The present disclosure relates to systems and methods for gas injected chemistry for single wafer processing. An example method includes generating, by a gas generator, a gas. The method also includes mixing, in a mixing tank, a gas-enriched chemical mixture comprising the gas and a chemical mixture. The method also includes dispensing, via a sample chamber, a dispensed volume of the gas-enriched chemical mixture onto the substrate. The method also includes returning a spent volume of the gas-enriched chemical mixture to the mixing tank.

A cleaning solution dilution system is provided for a paperboard converting plant. The system includes a panel that is provided with at least one of: a transport aid to move the system into a paper board converting plant, a mounting aid to hang the system on a wall of the paper board converting plant, or an installation aid having instructions printed directly on the panel. The system also includes at least two mixing apparatus, wherein each of the mixing apparatus includes an inlet for a cleaning solution, an inlet for other fluid, and an outlet for a mixture of the cleaning solution and other fluid. The system includes a plurality of isolation valves, a plurality of one-way valves, and a pressure-limiting valve. If provided, the instructions on the panel direct a user where to assemble the other components.

The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles. A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.