An ultrafine bubble generating apparatus and an ultrafine bubble generating method capable of efficiently generating an ultrafine bubble-containing liquid with high purity are provided. In order to this, a heating element provided in a liquid is caused to generate heat, and film boiling is made on an interface between the liquid and the heating element. A film boiling bubble is generated by the film boiling, and ultrafine bubbles are thus generated near the film boiling bubble.

Provided is an UFB generating apparatus and an UFB generating method capable of efficiently generating an UFB-containing liquid with high purity. To this end, the ultrafine bubble generating apparatus includes a pre-processing unit that performs predetermined pre-processing on a liquid W and a generating unit that generates ultrafine bubbles in the liquid on which the pre-processing is performed. The generating unit generates the ultrafine bubbles by causing a heating element, which is provided in the liquid on which the pre-processing is performed, to generate heat to generate film boiling on an interface between the liquid and the heating element.

Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquid and a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.

Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include a mixing manifold coupled between the remote plasma unit and the processing chamber. The mixing manifold may be characterized by a first end and a second end opposite the first end, and may be coupled with the processing chamber at the second end. The mixing manifold may define a central channel through the mixing manifold, and may define a port along an exterior of the mixing manifold. The port may be fluidly coupled with a first trench defined within the first end of the mixing manifold. The first trench may be characterized by an inner radius at a first inner sidewall and an outer radius, and the first trench may provide fluid access to the central channel through the first inner sidewall.

Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include a mixing manifold coupled between the remote plasma unit and the processing chamber. The mixing manifold may be characterized by a first end and a second end opposite the first end, and may be coupled with the processing chamber at the second end. The mixing manifold may define a central channel through the mixing manifold, and may define a port along an exterior of the mixing manifold. The port may be fluidly coupled with a first trench defined within the first end of the mixing manifold. The first trench may be characterized by an inner radius at a first inner sidewall and an outer radius, and the first trench may provide fluid access to the central channel through the first inner sidewall.

An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.

Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point. A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the (flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.

A diluted solution production method of the present invention is a diluted solution production method of producing a diluted solution of a second liquid by adding the second liquid a first liquid, the method including feeding the first liquid to a first pipe; and controlling pressure in a tank that stores the second liquid to add, through the second pipe that connects the tank to the first pipe, the second liquid to the first liquid in the first pipe. Adding the second liquid includes measuring a flow rate of the first liquid or the diluted solution that flows through the first pipe; measuring a component concentration of the diluted solution; and controlling the pressure in the tank, based on the measured values of the flow rate and the component concentration, so as to adjust the component concentration of the diluted solution to a specified value.

A nozzle flow stirring pipe includes a pipe body and a nozzle. The pipe body is cylindrical and includes an inner pipe member and an outer pipe member. The inner pipe member has a liquid-extracting channel. The outer pipe member fits around the inner pipe member. A reflow channel is defined between an inner wall of the outer pipe member and an outer wall of the inner pipe member. The nozzle is disposed at one end of the pipe body. The inner pipe member is penetratingly disposed at the nozzle and exposed from below. The nozzle has a plurality of liquid-ejecting pores in communication with one end of the reflow channel.

A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.