Provided is a shower head unit for control temperature for each area using a planar heating element and a substrate treating system having the same. The substrate treating system includes a housing, a shower head unit installed on an inner upper side of the housing and for entering a process gas for etching a substrate into the housing, and an electrostatic chuck installed on an inner lower side of the housing and for seating the substrate, wherein the shower head unit is installed as a planar heating element in a plurality of areas to control temperature for each area.

Provided is a shower head unit for control temperature for each area using a planar heating element and a substrate treating system having the same. The substrate treating system includes a housing, a shower head unit installed on an inner upper side of the housing and for entering a process gas for etching a substrate into the housing, and an electrostatic chuck installed on an inner lower side of the housing and for seating the substrate, wherein the shower head unit is installed as a planar heating element in a plurality of areas to control temperature for each area.

Systems and methods are provided for use with a thermoplastic road marking system (e.g., paint truck). The systems and methods control an insertion or replenishment rate of unmelted thermoplastic paint feed stock into a thermoplastic melter based, at least in part, on the rate that thermoplastic melt is being applied to a marking surface. By substantially matching the replenishment rate into the thermoplastic melter with the application rate, thermal variance within the thermoplastic melter is reduced, which improves the consistency of marking lines applied to surfaces.

Systems and methods are provided for use with a thermoplastic road marking system (e.g., paint truck). The systems and methods control an insertion or replenishment rate of unmelted thermoplastic paint feed stock into a thermoplastic melter based, at least in part, on the rate that thermoplastic melt is being applied to a marking surface. By substantially matching the replenishment rate into the thermoplastic melter with the application rate, thermal variance within the thermoplastic melter is reduced, which improves the consistency of marking lines applied to surfaces.

A pressure washer system comprises a cleaning fluid tank defining a cleaning fluid supply outlet, and a pump, engine and generator (PEG) unit including a pump defining a cleaning fluid pump inlet disposed vertically below the cleaning fluid supply outlet of the cleaning fluid supply tank.

A pressure washer system comprises a cleaning fluid tank defining a cleaning fluid supply outlet, and a pump, engine and generator (PEG) unit including a pump defining a cleaning fluid pump inlet disposed vertically below the cleaning fluid supply outlet of the cleaning fluid supply tank.

A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted; a first liquid supply part that supplies a first liquid to form a polymer film having a urea bond on the substrate mounted on the mounting table; a second liquid supply part that supplies a second liquid reacting with the first liquid; and a nozzle part provided at an end portion of a liquid flow path where the first liquid supplied from the first liquid supply part and the second liquid supplied from the second liquid supply part are joined with each other to obtain a mixed solution, and configured to supply the mixed solution to the substrate to form the polymer film on a surface of the substrate, wherein the polymer film is temporarily used for manufacturing the semiconductor device and is subsequently removed by depolymerization.

A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted; a first liquid supply part that supplies a first liquid to form a polymer film having a urea bond on the substrate mounted on the mounting table; a second liquid supply part that supplies a second liquid reacting with the first liquid; and a nozzle part provided at an end portion of a liquid flow path where the first liquid supplied from the first liquid supply part and the second liquid supplied from the second liquid supply part are joined with each other to obtain a mixed solution, and configured to supply the mixed solution to the substrate to form the polymer film on a surface of the substrate, wherein the polymer film is temporarily used for manufacturing the semiconductor device and is subsequently removed by depolymerization.

Presented herein are articles and methods relating to manufactured superhydrophobic, superoleophobic, and/or supermetallophobic surfaces with macro-scale features (macro features) configured to induce controlled asymmetry in a liquid film produced by impinging phase (e.g., impinging droplet(s)) onto the surface, thereby further reducing the contact time between an impinging liquid and the surface.

A multi-axis mechanism device includes: a base module, a first moving module, a second moving module, a third moving module, a reaction module, a tilting module and a rotating module. The first moving module performs a first axial movement relative to the movable bearing platform to drive the reaction module to be displaced relative to the movable bearing platform. The second moving module performs a second axial movement relative to the first moving module to drive the reaction module to be displaced relative to the first moving module. The third moving module drives the movable bearing platform to perform a third axial movement relative to the module body to drive the reaction module to be displaced relative to the module body. The reaction module is driven by the tilting module to perform titling action and by the rotating module to perform rotating operation relative to the central axis.