An apparatus for treating a substrate includes a treatment vessel having a treatment space therein, a substrate support unit that supports the substrate in the treatment space, and a liquid dispensing unit that dispenses a treatment liquid onto the substrate placed on the substrate support unit. The liquid dispensing unit includes a treatment liquid tube through which the treatment liquid flows, a constant-temperature water tube through which constant-temperature water flows and that surrounds the treatment liquid tube, wherein the constant-temperature water maintains the treatment liquid, which flows through the treatment liquid tube, at a set temperature, a constant-temperature water supply tube that supplies the constant-temperature water to the constant-temperature water tube, and an activation member that is installed in the constant-temperature water supply tube and that activates ions in the constant-temperature water.

The disclosure relates to an application device for applying an application medium onto a component, preferably for application of a coating onto a motor vehicle body component. The application device includes a print head for preferably serial and/or permanent application of the application medium, wherein the print head has: a nozzle plate, at least one nozzle in the nozzle plate in order to discharge the application medium, at least one valve element, which is movable relative to the nozzle plate, for control of the application medium discharge through the at least one nozzle, wherein the at least one movable valve element closes the at least one nozzle in a closing position and releases it in an opening position, and at least one drive for moving the at least one valve element. The application device is characterised in particular in that it includes at least one temperature control apparatus for reducing heating of the at least one drive during application of the application medium.

In one example, a pump assembly configured to connect to a manifold of an applicator includes a pump, a drive motor unit, and a thermal isolation region. The drive motor unit includes an output drive shaft connected to the pump and a drive motor configured to rotate the output drive shaft about a drive axis. The thermal isolation region is between the pump and the drive motor. The thermal isolation region includes an isolation plate and a thermal isolation frame. In one example, a cooling sleeve surrounds a proximal end portion of the drive motor unit so as to define an air flow passage between the proximal end portion of the drive motor unit and an inner surface of the cooling sleeve. In one example, the pump assembly further includes a coupling operatively connecting the pump and the drive shaft, the coupling including an insulating element therein.

Disclosed herein is a method for applying a liquid metal on a surface of an object that is selected from the group consisting of a heat-emitting surface and a heat-conducting surface. The method includes applying the liquid metal onto the surface, and applying a force to the liquid metal using a tool to destroy cohesion of the liquid metal, followed by moving the tool back and forth to apply the liquid metal on the surface.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

A coating system (1) is provided which includes an ultrasonic sprayer (3) capable of spraying a coating fluid onto a target surface (5). A convective or infrared heater (21) is associated with the sprayer and is operable to heat the spray (23) produced by the sprayer (3).

An apparatus changes the temperature of thermoplastic material in an extruder head to reduce the time for producing an object. The apparatus includes a cooling device located near the one or more nozzles of the extruder head to change the temperature of the thermoplastic material extruded by the extruder head. The apparatus cools the thermoplastic material to enhance the formation of exterior object features. A heater can also be positioned near the nozzle zone to heat the thermoplastic material to reduce the time for raising the viscosity of the thermoplastic material for forming interior regions of the object.

A dispensing system receives liquid material and process air. The dispensing system includes a manifold body having a liquid material passage and a process air passage. The dispensing system includes a heating member received in the manifold body. The heating member has an upper portion, a lower portion, an outer surface, and a groove in the outer surface. The groove may extend between the upper portion and the lower portion and form at least a portion of the process air passage. The dispensing system may further include a nozzle configured to dispense the liquid material. The heating member may be configured to heat the process air as the process air passes through the groove and heat the liquid material through contact of the outer surface of the heating member with the manifold body.

The present disclosure describes a leakage handling device and a method for handling a fluid leakage in a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus can include a lithography apparatus with a chuck configured to hold a substrate, and a photoresist feeder configured to dispatch a coating material on one or more areas of the substrate. The photoresist feeder can include a photoresist cartridge configured to output the coating material, a conduit fluidly connected to the photoresist cartridge, and a fluid leakage handling device disposed above the chuck, where the conduit can be configured to fluidly transport the coating material and circulate a coolant and the fluid leakage handling device can be configured to detect a fluid leakage from the conduit.