Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.

There is provided an embossed film in which the frequency of loss of concavities is smaller, the embossed film including: a film main body; and a plurality of concavities formed on a surface of the film main body. A diameter of an opening surface of the concavity is larger than a visible light wavelength, an arrangement pattern of the concavities has periodicity along a length direction of the film main body, and the difference between the rate of loss of concavities in one end portion of the film main body and the rate of loss of concavities in the other end portion of the film main body is 10 ppm or less.

There is provided an embossed film in which the frequency of loss of concavities is smaller, the embossed film including: a film main body; and a plurality of concavities formed on a surface of the film main body. A diameter of an opening surface of the concavity is larger than a visible light wavelength, an arrangement pattern of the concavities has periodicity along a length direction of the film main body, and the difference between the rate of loss of concavities in one end portion of the film main body and the rate of loss of concavities in the other end portion of the film main body is 10 ppm or less.

A main object of the present invention is to provide a method for manufacturing a binder-containing inorganic fiber molded body where localization of the binder is inhibited. The present invention achieves the object by providing a method for manufacturing a binder-containing inorganic fiber molded body including steps of: a binder solution coating step of coating an inorganic fiber molded body with a binder solution, and a liquid coating step of coating the inorganic fiber molded body coated with the binder solution with a liquid of which boiling point is less than 120° C.

A coated article, comprising an article having at least one surface having disposed thereupon an oxidation resistant coating comprising at least two constituents to form a composition, a first constituent comprising at least one thermal expansion component comprising at least about 10% by volume to up to about 99% by volume of the composition, a second constituent comprising at least one oxygen scavenger comprising at least about 1% by volume to up to about 90% by volume of the composition.

A coated article, comprising an article having at least one surface having disposed thereupon an oxidation resistant coating comprising at least two constituents to form a composition, a first constituent comprising at least one thermal expansion component comprising at least about 10% by volume to up to about 99% by volume of the composition, a second constituent comprising at least one oxygen scavenger comprising at least about 1% by volume to up to about 90% by volume of the composition.

The present invention relates to an anti-reflective film exhibiting one or more peaks (q.sub.max) at a scattering vector of 0.0758 to 0.1256 nm.sup.−1, in a graph showing a log value of scattering intensity to a scattering vector defined in small-angle X-ray scattering.

A composite structure may comprise a composite core comprising a composite material, and a heat resistant system coupled to the composite core comprising a binder and/or at least one of a heat dissipation material or a thermal barrier material. The heat dissipation material may comprise boron nitride, graphene, graphite, carbon fiber, carbon nanotubes, aluminum foil, and/or copper foil, and the thermal barrier material may comprise montmorillonite, aluminum hydroxide, magnesium hydroxide, silicate glass, mica powder or flake, aluminum oxide powder, titanium dioxide powder, and/or zirconium oxide powder. The binder may comprise at least one of polyvinyl alcohol, polyvinyl alcohol copolyacetate, polyacrylamide, polyethylene glycol, polyethylenimine, polyurethane, polyester, or latex.

A composite structure may comprise a composite core comprising a composite material, and a heat resistant system coupled to the composite core comprising a binder and/or at least one of a heat dissipation material or a thermal barrier material. The heat dissipation material may comprise boron nitride, graphene, graphite, carbon fiber, carbon nanotubes, aluminum foil, and/or copper foil, and the thermal barrier material may comprise montmorillonite, aluminum hydroxide, magnesium hydroxide, silicate glass, mica powder or flake, aluminum oxide powder, titanium dioxide powder, and/or zirconium oxide powder. The binder may comprise at least one of polyvinyl alcohol, polyvinyl alcohol copolyacetate, polyacrylamide, polyethylene glycol, polyethylenimine, polyurethane, polyester, or latex.

Magnesium phosphate cement binder systems and method for providing magnesium phosphate cements are described. In an embodiment, a magnesium phosphate cement binder system may include magnesium oxide that has been calcined at a temperature of between about 900° F. to about 1800° F. The magnesium phosphate cement binder system may also include a phosphate material. Other formulations, compositions, and methods are also described.