B05D1/32

METHOD FOR FORMING METAL PATTERN, AND ELECTRIC CONDUCTOR

The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.

METHOD FOR FORMING METAL PATTERN, AND ELECTRIC CONDUCTOR

The present invention provides a method for forming a metal pattern on a pattern formation section set in a part or the whole of a region on a base material, the base material including a fluorine-containing resin layer on a surface including at least the pattern formation section, the method including the step of: forming a functional group on a pattern formation section of the fluorine-containing resin layer by a treatment such as ultraviolet-ray irradiation, then applying to the surface of the base material a metal fine particle dispersion liquid in which metal fine particles protected by an amine compound as a first protective agent and a fatty acid as a second protective agent are dispersed in a solvent, and fixing the metal fine particles on the pattern formation section.

SUBSTRATE STRUCTURE HAVING COLD SPRAYED LAYER AND METHOD FOR MANUFACTURING THE SAME
20220234071 · 2022-07-28 ·

A substrate structure having a cold sprayed layer and a method for manufacturing the same are provided. The substrate structure having the cold sprayed layer includes a base layer and the cold sprayed layer. The cold sprayed layer is formed on a predetermined area of the base layer by spraying and dissolving. An included angle is formed between at least one side surface of the cold sprayed layer and the base layer.

Method and composition for selectively modifying base material surface

A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including silicon. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the silicon. The first region preferably contains a silicon oxide, a silicon nitride, or a silicon oxynitride. The base material preferably further includes a second region that is other than the first region and that contains a metal; and the method preferably further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film.

METAL SURFACE PROTECTION

Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.

Apparatus for forming a shaped film product

A process capable of commercial scale manufacturing of inexpensive, shaped film products includes placing a mask over a substrate; delivering a film-forming composition through a nozzle to form a raw shape on the substrate; removing the mask; and solidifying the film-forming composition to provide the shaped film product disposed on the substrate. The mask has a delivery surface and an opposite substrate-facing surface and at least one aperture having a design corresponding to the desired shaped film product. The nozzle is disposed in sealing engagement with the delivery surface of the mask to the at least one aperture of the mask during delivery of the film-forming composition.

Methods for manufacturing panels and panel obtained thereby

A method may be provided for manufacturing coated panels of the type including at least a substrate and a top layer with a motif. The top layer may be provided on the substrate. The method may involve providing a synthetic material layer on the substrate. A relief may be provided on the surface of said synthetic material layer provided on the substrate. The relief may include a pattern of recesses. The pattern may be at least partially determined by at least one print that is applied by inkjet printing. The relief may be obtained by printing a mask directly on or in the synthetic material layer. After providing the mask, the synthetic material layer may be cured. The mask may provide for selective curing of the synthetic material layer, such that the synthetic material layer is not solidified or solidified at a lesser extent in correspondence of the mask. The not solidified or less solidified portions of the synthetic material layer may be removed by performing a material-removing treatment on the synthetic material layer thereby obtaining the relief.

Lift-off method by means of jetting
11198265 · 2021-12-14 · ·

A method for structured coating of a surface of a substrate. The surface includes spaced optical elements and at least partially metallic elements provided adjacent the optical elements. After the application of the method, the optical elements should be completely covered with the coating, whereas at least some of the metallic elements should not be coated on the major part of their surface. The method includes: a) providing the substrate with the spaced optical elements and metallic elements; b) applying a sacrificial material to at least some of the metallic elements to form sacrificial spots; c) coating the surface of the substrate with a layer system; and d) detaching the sacrificial spots from the substrate, wherein the regions of the layer system on the sacrificial spots are also detached from the substrate. The application of the sacrificial material is carried out at least partially by jetting.

DEVICES AND METHODS FOR REMOVAL OF ACUTE BLOCKAGES FROM BLOOD VESSELS

Manufacturing an expandable body of a clot retrieval device having a first coating of radiopaque material defining a plurality of micro-columns and a second coating, the method including applying the first coating to strut elements, removing at least a portion of the first coating from at least one area of the strut elements, and cutting away regions of both the first coating and the strut elements to form an interconnected pattern of coated and uncoated regions.

FILM FORMING METHOD AND FILM FORMING APPARATUS

A film forming method is a method of forming a film on a substrate top face including a first region in which a metal or a semiconductor is exposed and a second region in which an insulator is exposed. The method includes a SAM forming process of forming a self-assembled monolayer film of a perfluoropolyether group-containing compound on the first region and a film growth process of forming a predetermined film on the second region after execution of SAM forming process.