There is provided a technique that includes (a) supplying a fluorine-containing gas to a substrate including a first surface and a second surface; (b) supplying an oxygen- and hydrogen-containing gas and a catalyst to the substrate after performing (a); (c) supplying a modifying agent to the substrate after performing (b); and (d) supplying a film-forming agent to the substrate after performing (c).

A method and a device for manufacturing a base layer (3) having different degrees of hardness is disclosed. Further a workpiece with a base layer (3) manufactured by such method is disclosed.

A method and a device for manufacturing a base layer (3) having different degrees of hardness is disclosed. Further a workpiece with a base layer (3) manufactured by such method is disclosed.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

The present disclosure relates to a method for forming a parting line in a coating using an easily peelable coating material. The method includes: (i) attaching a masking tape to a part not to be coated on a boundary between a part to be coated and the part not to be coated along the boundary; (ii) performing a process to improve an adhesiveness with an easily peelable coating material on surfaces of a part in contact with the boundary of the part to be coated and/or a part in contact with the boundary of the masking tape; (iii) applying the easily peelable coating material over surfaces of the part to be coated and the part in contact with the boundary of the masking tape; and (iv) peeling off the masking tape.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

Photocurable compositions and methods of preparation and use of such compositions. More particularly, photocurable compositions useful for forming topographical features on surfaces such as membrane surfaces. Methods of forming topographical features on a membrane surface using photocurable compositions.

Photocurable compositions and methods of preparation and use of such compositions. More particularly, photocurable compositions useful for forming topographical features on surfaces such as membrane surfaces. Methods of forming topographical features on a membrane surface using photocurable compositions.

The present disclosure provides a thin-film-deposition equipment with double-shaft shielding device, which includes a reaction chamber, a carrier and a double-shaft shielding device. The double-shaft shielding device includes a first-connecting arm, a second-connecting arm, a first-shield member, a second-shield member, a first driver and a second driver. The first driver is connected to the first-shield member via the first-connecting arm, and the second driver is connected to the second-shield member via the second-connecting arm, for respectively driving and swinging the two shield members to move in opposite directions via the two connecting arms. Thereby, during a cleaning process of the thin-film-deposition equipment, the two drivers swing the two shield members toward each other into a shielding state for covering the carrier, such that to effectively prevent removed pollutants from polluting the carrier during.

An application device according to an embodiment includes a liquid nozzle part, an air nozzle part, and an ejection controlling unit. The liquid nozzle part ejects liquid to be applied to an electronic component mounted on a substrate. The air nozzle part ejects air toward the substrate. The air nozzle is concentrically arranged with respect to the liquid nozzle part. The ejection controlling unit ejects the air from the air nozzle part at a timing in synchronization with an ejection timing of the liquid to be applied by the liquid nozzle part.