The present disclosure relates to a coating method of implant using parylene, for coating a surface of a dental implant, including a pretreating step of pretreating the implant; and a coating step of coating a surface of the pretreated implant with a coating material to form a polymer coating layer, wherein the coating material is provided as parylene.

According to the present disclosure, a parylene thin film may be uniformly coated on the surface of the dental implant, and according to such a thin film, the growth of anaerobic bacteria can be effectively inhibited in spaces where the fixture and the upper structure of the dental implant are joined to each other, and where the upper structure and the crown are joined to each other.

A surface treatment agent including a compound represented by the general formula HO—P(═O)R.sup.1R.sup.2 in which R.sup.1 and R.sup.2 are each independently bonded to the phosphorus atom and are each independently a hydrogen atom, an alkyl group, a fluorinated alkyl group, or an aromatic hydrocarbon group which may have a substituent, provided that R.sup.1 and R.sup.2 are not hydrogen atoms at the same time, and an organic solvent.

A film formation method includes: preparing a substrate including, on its surface, a first region in which a first material is exposed and a second region in which a second material different from the first material is exposed; selectively forming a self-assembled monolayer in the first region, among the first region and the second region; and forming a desired target film in the second region, among the first region and the second region, by using the self-assembled monolayer formed in the first region, wherein the selectively forming the self-assembled monolayer includes: selectively forming the self-assembled monolayer in the first region by using a first processing liquid including a first raw material of the self-assembled monolayer; and modifying the self-assembled monolayer, by using a second processing liquid including a second raw material of the self-assembled monolayer at a concentration different from a concentration of the first processing liquid.

Systems, methods, and apparatus for encapsulating objects like that of microelectronic components and batteries. The system includes three successive layers that include a first covering layer composed of an electrically insulating material deposited by atomic layer deposition, which at least partly covers the object, a second covering layer that includes parylene and/or polyimide, and which is disposed on the first covering layer, and a third covering layer deposited on the second covering layer in such a way as to protect the second encapsulation layer, namely, with respect to oxygen, and thereby increase the service life of the object.

Methods of modulating flow during vapor jet deposition of organic materials are provided. A method may include ejecting a vapor entrained in a delivery gas from a nozzle onto a substrate upon which the vapor condenses. A confinement gas may be provided that has a flow direction opposing a flow direction of the delivery gas ejected from the nozzle. A vacuum source may be provided that is adjacent to a delivery gas aperture of the nozzle. The method may include adjusting, by an actuator, a fly height separation between a deposition nozzle aperture of the nozzle and a deposition target.

The present invention provides a method of treating a surface of a substrate, the method comprising: a) growing a microbe on the surface of the substrate to be treated to form a layer of microbial structures, wherein the microbe is selected from fungi, algae, lichens and any combination thereof; and b) coating the microbial structures to form a first coating thereon, wherein the first coating has a thickness of no more than 1 μm. The present invention also provides an article comprising a layer of microbial structures, optionally made by using the method of the present invention.

Disclosed are methods for forming thin polymeric films on a surface of an article by deposition from the vapor phase. In certain embodiments, the method comprises depositing the polymeric film in situ inside a space or enclosure contained within the article. In other embodiments, the method comprises depositing a film from vapor phase by thermal degradation of an initiator precursor without the need for an external filament.

A device for separating analytes is disclosed. The device has a sample injector, sample injection needle, sample reservoir container in communication with the sample injector, chromatography column downstream of the sample injector, and fluid conduits connecting the sample injector and the column. The interior surfaces of the fluid conduits, sample injector, sample reservoir container, and column form a flow path having wetted surfaces. A portion of the wetted surfaces of the flow path are coated with an alkylsilyl coating that is inert to at least one of the analytes. The alkylsilyl coating has the Formula I: ##STR00001##
R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are each independently selected from (C.sub.1-C.sub.6)alkoxy, —NH(C.sub.1-C.sub.6)alkyl, —N((C.sub.1-C.sub.6)alkyl).sub.2, OH, OR.sup.A, and halo. R.sup.A represents a point of attachment to the interior surfaces of the fluidic system. At least one of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 is OR.sup.A. X is (C.sub.1-C.sub.20)alkyl, —O[(CH.sub.2).sub.2O].sub.1-20—, —(C.sub.1-C.sub.10)[NH(CO)NH(C.sub.1-C.sub.10)].sub.1-20—, or —(C.sub.1-C.sub.10)[alkylphenyl(C.sub.1-C.sub.10)alkyl].sub.1-20-.

So as to perform a vacuum surface treatment on a workpiece at a predetermined temperature, which is different from a temperature to which the surface is exposed during the vacuum surface treatment, the workpiece is conveyed in a conveyance direction along one or more than one station group including one or more than one tempering station and of a single treatment station.

An implantable device includes a flexible cable, a circuit chip, a fluid adhesion layer, and a vapor deposited layer. The flexible cable includes a lead-in part, a stimulation part and a connection part connected between the lead-in part and the stimulation part. The circuit chip is fixed to a surface of one side of the lead-in part, and is electrically connected to the lead-in part. The fluid adhesion layer is adhered to an outer side of the circuit chip and an outer side of the lead-in part. The vapor deposited layer (4) is directly deposited on an outer side of the fluid adhesion layer.